Methods of contacting and/or treating a subterranean formation
Abstract
Methods of contacting a subterranean formation are described which provide improved control or reduction of particulate migration, transport or flowback in wellbores and reservoirs, and which may do so without sacrificing substantial hydraulic conductivity. One method comprises injecting into a well-bore intersecting the subterranean formation a fluid composition comprising a first component and a second component dispersed in a carrier fluid, at least a portion of the first component or second component being provided as at least one multicomponent article having an aspect ratio greater than 1:1.1; forming a network comprising the first component; and binding the network with the second component.
Claims
exact text as granted — not AI-modified1 . A method of contacting a subterranean formation comprising:
injecting into a well-bore intersecting the subterranean formation a fluid composition comprising a first component and a second component dispersed in a carrier fluid, at least a portion of the first component or at least a portion of the second component being provided as at least one multicomponent article having an aspect ratio greater than 1:1.1; forming a network comprising the first component; and binding the network with the second component.
2 . (canceled)
3 . (canceled)
4 . The method of claim 1 wherein the forming and binding are performed subsequent to injecting.
5 . The method of claim 1 further comprising modifying at least one of the first or second components by at least one controlled modification process after injection into the wellbore.
6 . The method of claim 1 wherein at least some of the multicomponent articles have a shape selected from hollow, prismatic, cylindrical, lobed, rectangular, polygonal, dog-boned, faceted, combinations of these, and mixtures thereof.
7 . The method of claim 1 wherein at least some of the multicomponent articles are different from other multicomponent articles in the fluid composition.
8 . (canceled)
9 . The method of claim 1 wherein at least some multicomponent articles comprise the first component and the second component, and wherein other multicomponent articles comprise a third component and a fourth component.
10 . (canceled)
11 . The method of claim 1 wherein at least some of the multicomponent articles further comprise a third component.
12 . (canceled)
13 . The method of claim 1 wherein at least one of the first or second components is an activated adhesive.
14 . (canceled)
15 . The method of claim 1 wherein one of the first component and second component have a modulus of less than 3×10 6 dynes/cm 2 (3×10 5 N/m 2 ) at a frequency of about 1 Hz at a temperature greater than −60° C.
16 . The method of claim 1 wherein the fluid composition further comprises proppant.
17 . A method of contacting a subterranean formation comprising:
injecting into a well-bore intersecting the subterranean formation a fluid composition comprising a first component and a second component dispersed in a carrier fluid, wherein the first component and the second component are provided as separate articles to the carrier fluid separately prior to injection; forming a network comprising at least one first component article in direct contact with another first component article; and binding the network with the second component.
18 . The method of claim 17 further comprising modifying at least one of the first or second components upon or after injection into the wellbore.
19 . The method of claim 18 wherein the modification process is selected from chemical, physical, mechanical, radiation, and combinations thereof.
20 - 23 . (canceled)
24 . The method of claim 17 wherein at least one of the first component or second component is an activated adhesive.
25 - 32 . (canceled)
33 . A method of contacting a subterranean formation comprising:
injecting into a well-bore intersecting the subterranean formation a fluid composition comprising a first component and a second component dispersed in a carrier fluid; forming a network comprising the first component; and binding the network with the second component, wherein the second component is selected to be tacky at a specific downhole temperature and have a modulus of less than 3×10 6 dynes/cm 2 (3×10 5 N/m 2 ) at a frequency of about 1 Hz at a temperature greater than −60° C.
34 . The method of claim 33 wherein the first component and second component are blended together.
35 - 37 . (canceled)
38 . The method of claim 1 , wherein the contacting comprises
pumping under pressure into the well-bore.
39 - 50 . (canceled)
51 . A method of reducing migration of solids comprising:
providing a fluid composition into a well-bore, the well-bore intersecting a subterranean formation, the fluid composition comprising a first component and a second component dispersed in a carrier fluid, at least one of the first component and second component having an aspect ratio greater than 1:1.1, wherein the second component is selected to be tacky at a specific downhole temperature and have a modulus of less than 3×10 6 dynes/cm 2 (3×10 5 N/m 2 ) at a frequency of about 1 Hz at a temperature greater than −60° C.; forming a network comprising the first component; binding the network with the second component; and contacting the subterranean formation with the fluid composition.
52 - 56 . (canceled)
57 . The method of claim 51 wherein the second component is an activated adhesive.
58 . (canceled)
59 . The method of claim 51 further comprising modifying the second component after providing the fluid composition into the well-bore.
60 - 61 . (canceled)
62 . The method of claim 51 wherein the solids comprise formation fines.
63 . (canceled)
64 . The method of claim 59 wherein second component is modified by a process selected from temperature activation, chemical activation, pressure activation, mechanical activation, curing, exposure to electromagnetic fields, exposure to electromagnetic radiation, exposure to ionizing radiation, physical entanglement, degradation, concurrently application of at least two of these processes, consecutive application of at least two of these processes, and combinations thereof.
65 .- 67 . (canceled)Join the waitlist — get patent alerts
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