Method for Electrochemical Fabrication

Abstract

An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

1 . An electroplating method for fabricating a multi-layer three-dimensional structure, comprising:
 (i) forming a first layer comprising depositing a first structural material and a first sacrificial material and planarizing the deposited first structural material and first sacrificial material to set a boundary level of the first layer; and   (ii) forming additional layers with an initial additional layer formed on and adhered to the first layer and with subsequent additional layers formed on and adhered to previously formed additional layers, wherein the forming of each additional layer comprises depositing an additional structural material and depositing an additional sacrificial material and planarizing of the deposited additional structural material and additional sacrificial material to set a boundary level for each additional layer;   wherein after formation of a plurality of the additional layers, performing the following steps in order:
 (a) etching away a volume of sacrificial material to form a void within a multi-layer cavity defined by structural material; 
 (b) depositing a secondary structural material into the void within the cavity. 
   
     
     
         2 . The method of  claim 1  wherein the deposition of the sacrificial material on a given additional layer occurs selectively via a mask placed in contact with a previously formed layer. 
     
     
         3 . The method of  claim 2  wherein the deposition of the structural material for the given additional layer occurs via a blanket deposition. 
     
     
         4 . The method of  claim 1  wherein the additional structural material for at least a portion of the additional layers comprises a metal and the additional sacrificial material for at least a portion of the additional layers comprises a metal. 
     
     
         5 . The method of  claim 4  wherein the secondary structural material comprises a powder material. 
     
     
         6 . The method of  claim 5  wherein powder material comprises a magnetic material. 
     
     
         7 . The method of  claim 6  wherein after deposition of the powder material, the powder material is sintered. 
     
     
         8 . The method of  claim 1  wherein after deposition of the powder material, one or more further layers are formed with each comprising a further deposited structural material and a further deposited sacrificial material.