Module for cooling semiconductor device

Abstract

A module for cooling a heat generating element comprising a heat receiving plate thermally connected to at least one heat generating element; a heat transfer device one end portion of which is thermally connected to the heat receiving plate and other end portion of which is thermally connected to a heat dissipating plate; a thermoelectric cooler one face of which is thermally connected to one face of the heat dissipating plate; a first heat sink thermally connected to other face of the heat dissipating plate; and a second heat sink thermally connected to other face of said thermoelectric cooler.

1 . A cooling module for a heat generating element of a semiconductor element type, comprising:
 a heat receiving/spreading device thermally connected to the heat generating element;   a thermoelectric cooler integrally formed with and thermally connected to said heat receiving/spreading device;   a first heat sink thermally connected to said thermoelectric cooler; and   a TEC heat path provided by said thermoelectric cooler and said first heat sink;   a power reduction mechanism configured to reduce power consumed by said thermoelectric cooler, said power reduction mechanism being thermally connected to said heat receiving/spreading device to transfer heat of said heat generating element in another direction; and   said power reduction mechanism comprising a heat pipe and a second heat sink thermally connected to said heat pipe, thereby forming an unconditionally divided heat path.   
     
     
         2 . The cooling module of  claim 1 , wherein said first and second heat sinks are separated heat sinks. 
     
     
         3 . The cooling module as claimed of  1 , wherein said first and second heat sinks are integrated such that said second heat sink is stacked on said first heat sink. 
     
     
         4 . The cooling module as claimed of  claim 3 , wherein said first and second heat sinks are formed by a single heat sink such that a lower part of the single heat sink constitutes said first heat sink and an upper part of the single heat sink constitutes said second heat sink. 
     
     
         5 . The cooling module of  claim 1 , wherein said heat pipe comprises a U-shaped round heat pipe having a prescribed elasticity, said thermoelectric cooler and said first heat sink are arranged to be sandwiched by said second heat sink and said heat receiving/spreading device, thereby lowering a contact heat resistance. 
     
     
         6 . The cooling module of  claim 1 , wherein through holes are provided in corresponding prescribed positions in said heat receiving/spreading device, said thermoelectric cooler, said first heat sink and said second heat sink, respectively, and said heat receiving/spreading device, said thermoelectric cooler, said first heat sink and said second heat sink are fastened by corresponding screws. 
     
     
         7 . The cooling module as claimed in  claim 6 , wherein a fastening force of said screws is controlled so as to provide a constant torque. 
     
     
         8 . The cooling module of  claim 1 , wherein-said heat generating element has a heat value of at least 100 W. 
     
     
         9 . The cooling module of  claim 1 , further comprising a soft metal foil as a thermal interface material is arranged between said heat receiving/spreading device and said thermoelectric cooler, as well as between said thermoelectric cooler and said first heat sink, respectively. 
     
     
         10 . The cooling module of  claim 1 , further comprising another heat pipe thermally connected to said heat receiving/spreading device to transfer heat from another heat generating element included in the heat generating element of the semiconductor element type to said heat receiving/spreading device. 
     
     
         11 - 26 . (canceled) 
     
     
         27 . The cooling module of  claim 1 , wherein said thermoelectric cooler is controlled such that when a heat energy of the heat generating element is less than a predetermined value, electric power consumption of the cooler is minimized whereas most of the heat energy less than the predetermined value is dissipated by means of said power reduction mechanism.