Copper electrolytic solution and electrolytic copper foil produced therewith

Abstract

The present invention provides a copper electrolytic solution used to obtain a low-profile electrolytic copper foil with a low surface roughness on the rough side (the opposite side from the glossy side) in the production of an electrolytic copper foil using a cathode drum and, more particularly, to provide a copper electrolytic solution used to obtain an electrolytic copper foil that has excellent transmission loss characteristics at a high frequency, can be finely patterned, and has excellent elongation and tensile strength, both at ordinary and high temperatures. The copper electrolytic solution of the present invention contains (A) at least one quaternary amine salt selected from the group consisting of (a) quaternary amine salts obtained by a reaction between epichlorohydrin and an amine compound mixture composed of a secondary amine compound and a tertiary amine compound, and (b) polyepichlorohydrin quaternary amine salts, and (B) an organic sulfur compound.

1 . An electrolytic copper foil produced using a copper electrolytic solution comprising:
 (A) a quaternary amine salt obtained by a reaction between epichlorohydrin and an amine compound mixture composed of a secondary amine compound and a tertiary amine compound; and   (B) an organic sulfur compound,   wherein the quaternary amine salt is expressed by the following General Formula (2):   
       
         
           
           
               
               
           
         
       
       and, in General Formula (2), R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , and R 7  are each a methyl group or ethyl group, and n is a number from 1 to 1000. 
     
     
         2 . The electrolytic copper foil according to  claim 1 , wherein the organic sulfur compound is expressed by the following General Formula (3) or (4):
   X—R 1 —(S) n —R 2 —Y  (3)     R 4 —S—R 3 —SO 3 Z  (4),   
       in General Formulas (3) and (4), R 1 , R 2 , and R 3  are each an alkylene group with 1 to 8 carbon atoms, R 4  is selected from the group consisting of hydrogen, 
       
         
           
           
               
               
           
         
       
       X is selected from the group consisting of hydrogen, a sulfonic acid group, a phosphonic acid group, and an alkali metal salt or ammonium base of sulfonic acid or phosphonic acid, Y is selected from the group consisting of a sulfonic acid group, a phosphonic acid group, and an alkali metal salt of sulfonic acid or phosphonic acid, Z is hydrogen or an alkali metal, and n is 2 or 3. 
     
     
         3 . The electrolytic copper foil according to  claim 1 , wherein the electrolytic copper foil has a surface roughness Rz of 1.02 to 1.78 μm, an ordinary-temperature elongation of 3.00 to 10.340, an ordinary-temperature tensile strength of 33.1 to 76.5 kgf/mm 2 , a high-temperature elongation of 8.8 to 18.5%, and a high-temperature tensile strength of 20.0 to 23.0 kgf/mm 2 . 
     
     
         4 . A copper-clad laminated board produced using the electrolytic copper foil according to  claim 1 .