US2010279021A1PendingUtilityA1

Apparatus for depositing organic material and depositing method thereof

Assignee: SAMSUNG MOBILE DISPLAY CO LTDPriority: May 4, 2009Filed: Apr 19, 2010Published: Nov 4, 2010
Est. expiryMay 4, 2029(~2.8 yrs left)· nominal 20-yr term from priority
H10K 71/441C23C 14/12B05D 1/02C23C 14/56H10K 71/16H10K 71/00B05D 3/0493C23C 14/243B05D 1/60H10K 71/191
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Claims

Abstract

An apparatus for depositing an organic material and a depositing method thereof, wherein a deposition process is performed with respect to a second substrate while transfer and alignment processes are performed with respect to a first substrate in a chamber, so that loss of an organic material wasted in the transfer and alignment processes can be reduced, thereby maximizing material efficiency and minimizing a processing tack time. The apparatus includes a chamber having an interior divided into a first substrate deposition area and a second substrate deposition area, an organic material deposition source transferred to within ones of the first and second substrate deposition areas to spray particles of an organic material onto respective ones of first and second substrates and a first transferring unit to rotate the organic material deposition source in a first direction from one of the first and second substrate deposition areas to an other of the first and second substrate deposition areas.

Claims

exact text as granted — not AI-modified
1 . A deposition apparatus, comprising:
 a chamber having an interior divided into a first substrate deposition area and a second substrate deposition area;   an organic material deposition source transferred to within ones of the first and second substrate deposition areas to spray particles of an organic material onto respective ones of first and second substrates; and   a first transferring unit to rotate the organic material deposition source in a first direction from one of the first and second substrate deposition areas to an other of the first and second substrate deposition areas.   
     
     
         2 . The apparatus of  claim 1 , further comprising a second transferring unit to reciprocate the organic material deposition source in a second direction within one of the first and second substrate deposition areas. 
     
     
         3 . The apparatus of  claim 1 , further comprising:
 a first substrate aligning unit positioned in the first substrate deposition area to align the first substrate transferred from an outside; and   a second substrate aligning unit positioned in the second substrate deposition area to align the second substrate transferred from the outside.   
     
     
         4 . The apparatus of  claim 1 , wherein the first substrate deposition area and the second substrate deposition area extend in a second direction that intersects the first direction. 
     
     
         5 . The apparatus of  claim 1 , wherein the organic material deposition source is a linear deposition source. 
     
     
         6 . The apparatus of  claim 1 , wherein a body of the chamber is a polygonal container having a first side adjacent to the first transferring unit that is longer than a second side opposite the first side. 
     
     
         7 . The apparatus of  claim 6 , wherein the first and second substrates enter and exit the chamber through the second side of the chamber. 
     
     
         8 . A method of depositing an organic material, comprising:
 transferring a first substrate into a first substrate deposition area of a chamber and performing an alignment process on the first substrate;   transferring a deposition source to within the first substrate deposition area to perform a deposition process on the first substrate after completion of the alignment process on the first substrate;   transferring a second substrate into a second substrate deposition area of the chamber and performing an alignment process on the transferred second substrate while the deposition process on the first substrate is being performed;   transferring the deposition source to the second substrate deposition area by rotating the deposition source in a first direction when the deposition process on the first substrate and the alignment process on the second substrate are completed; and   transferring the deposition source within the second substrate deposition area to perform the deposition process on the second substrate.   
     
     
         9 . The method of  claim 8 , further comprising transferring a third substrate into the first substrate deposition area of the chamber and performing an alignment process with respect to the third substrate while performing the deposition process with respect to the second substrate. 
     
     
         10 . An apparatus, comprising:
 a chamber having an interior divided into a first substrate deposition area, a standby area, and a second substrate deposition area;   a first substrate aligning unit positioned in the first substrate deposition area to align a first substrate transferred from an outside;   a second substrate aligning unit positioned in the second substrate deposition area to align a second substrate transferred from the outside;   at least one organic material deposition source to spray particles of an organic material onto ones of the first and second substrates; and   a transferring unit to transfer the organic material deposition source in a first direction.   
     
     
         11 . The apparatus of  claim 10 , further comprising:
 a deposition source holding unit to hold the organic material deposition source; and   an angle limiting plate arranged on an upper outer wall of the deposition source holding unit.   
     
     
         12 . The apparatus of  claim 10 , wherein the first substrate deposition area, the standby area, and the second substrate deposition area are arranged in a line extending in the first direction. 
     
     
         13 . A method of depositing an organic material, comprising:
 positioning a deposition source in a standby area of a chamber while a first substrate is transferred from an outside into a first substrate deposition area of the chamber and while an alignment process is being performed on the first substrate;   performing a deposition process with respect to the first substrate by transferring the deposition source positioned in the standby area of the chamber into the first substrate deposition area after the alignment process with respect to the first substrate is completed;   transferring a second substrate from an outside into a second substrate deposition area and performing an alignment process with respect to the second substrate;   transferring the deposition source from the first substrate deposition area back to the standby area of the chamber after the deposition process with respect to the first substrate is completed; and   performing a deposition process with respect to the second substrate by transferring the deposition source positioned in the standby area of the chamber into the second substrate deposition area after the alignment process with respect to the second substrate is completed.   
     
     
         14 . The method of  claim 13 , wherein the alignment process with respect to the second substrate is performed while the deposition process is being performed with respect to the first substrate. 
     
     
         15 . The method of  claim 13 , further comprising:
 transferring the first substrate from the first substrate deposition area of the chamber to the outside upon completion of the deposition process on the first substrate; and   transferring a third substrate into the first substrate deposition area of the chamber from the outside.   
     
     
         16 . A deposition system, comprising:
 a plurality of organic material deposition apparatuses;   a transfer chamber to commonly connect the plurality of organic material deposition apparatuses; and   a load lock chamber to load and/or unload substrates inserted into the organic material deposition apparatuses through the transfer chamber, wherein the plurality of organic material deposition apparatuses comprises a first organic material deposition apparatus to perform a deposition process with respect to at least two substrates and to perform transfer and an alignment processes of at least one of the at least two substrates while performing the deposition process with respect to an other of the at least two substrates.   
     
     
         17 . The system of  claim 16 , wherein the plurality of organic material deposition apparatuses further comprises a second organic material deposition apparatus to sequentially perform a transfer process, an alignment process, and a deposition process with respect to a single substrate. 
     
     
         18 . The system of  claim 16 , wherein the first organic material deposition apparatus comprises:
 a chamber having an interior divided into a first substrate deposition area and a second substrate deposition area;   an organic material deposition source transferred to within ones of the first and second substrate deposition areas to spray particles of an organic material onto respective ones of first and second substrates; and   a transferring unit to rotate the organic material deposition source in a first direction from one of the first and second substrate deposition areas to an other of the first and second substrate deposition areas.   
     
     
         19 . The system of  claim 18 , wherein the chamber is a polygonal container having a first side adjacent to the first transferring unit that is longer than a second side opposite the first side. 
     
     
         20 . The system of  claim 19 , wherein the first and second substrates enter and exit the chamber through the second side of the chamber.

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