US2010282301A1PendingUtilityA1

Glass substrate coated with layers having improved resistivity

Assignee: SAINT GOBAINPriority: Oct 25, 2007Filed: Oct 22, 2008Published: Nov 11, 2010
Est. expiryOct 25, 2027(~1.3 yrs left)· nominal 20-yr term from priority
H10F 77/1696H10F 77/1694H10F 77/244H10F 77/169H10F 71/138C03C 17/3435C03C 17/3671Y10T428/265C03C 17/3678Y02E10/541C03C 2217/94
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Claims

Abstract

A transparent glass substrate, associated with a stack of thin layers forming an electrode, the stack comprising a barrier underlayer that is a barrier to alkalis, and an electroconductive layer, said electroconductive layer being coated with an overlayer for protection against oxidation, characterized in that the stack comprises a metallic blocking layer capable of being oxidized during a heat treatment.

Claims

exact text as granted — not AI-modified
1 . A transparent glass substrate, having a stack of thin layers forming an electrode, the stack comprising a barrier underlayer that is a barrier to alkalis, an electroconductive layer, said electroconductive layer being coated with an overlayer for protection against oxidation, wherein the stack comprises a metallic blocking layer capable of being oxidized during a heat treatment, the blocking layer being situated below the electroconductive layer. 
     
     
         2 . The substrate as claimed in  claim 1 , wherein the metallic blocking layer comprises titanium, chromium, nickel, niobium, zinc, tin, or a mixture thereof. 
     
     
         3 . The substrate as claimed in  claim 1 , wherein a thickness of the metallic blocking layer is between 0.5 and 20 nm. 
     
     
         4 . The substrate as claimed in  claim 1 , wherein a metallic blocking layer is situated above the electroconductive layer. 
     
     
         5 . The substrate as claimed in  claim 1 , wherein a blocking layer is situated above and another blocking layer is situated below the electroconductive layer, the materials forming each of the blocking layers being different. 
     
     
         6 . The substrate as claimed in  claim 1 , wherein the barrier underlayer comprises a dielectric material. 
     
     
         7 . The substrate as claimed in  claim 1 , wherein the dielectric material comprises at least one of silicon nitrides, oxides or oxynitrides, aluminum nitrides, oxides or oxynitrides, titanium nitrides, oxides or oxynitrides, zirconium nitrides, oxides or oxynitrides, and a mixture thereof. 
     
     
         8 . The substrate as claimed in  claim 1 , wherein a thickness of the barrier underlayer is between 3 and 250 nm. 
     
     
         9 . The substrate as claimed in  claim 1 , wherein the overlayer for protection against oxidation is identical to the alkali barrier underlayer. 
     
     
         10 . The substrate as claimed in  claim 1 , wherein the electroconductive layer comprises an oxide doped with Sn, Zn, Ti or In. 
     
     
         11 . The substrate as claimed in  claim 1 , wherein a thickness of the electroconductive layer is between 50 and 1500 nm. 
     
     
         12 . The substrate as claimed in  claim 1 , wherein a resistivity of the electrode is reduced after having been subjected to the heat treatment. 
     
     
         13 . A photovoltaic cell comprising a substrate according to  claim 1 .

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