Method for producing conductive film and light-sensitive material for conductive film production

Abstract

A method for producing a conductive film, which comprises: exposing and developing a light-sensitive material comprising a support and thereon an emulsion layer containing a silver salt emulsion to form a metallic silver; and then subjecting the light-sensitive material to a smoothing treatment (such as a calender treatment).

1 . A method for producing a conductive film, which comprises:
 exposing and developing a light-sensitive material comprising a support and thereon an emulsion layer containing a silver salt emulsion to form a metallic silver portion; and then   subjecting the light-sensitive material to a smoothing treatment which is performed with a calender roll unit at a line pressure of 980 N/cm (100 kgf/cm) or more.   
     
     
         2 . The method according to  claim 1 , which comprises:
 exposing and developing a light-sensitive material comprising a support and thereon an emulsion layer containing a silver salt emulsion to form a metallic silver portion and a light-transmitting portion; and then   subjecting the light-sensitive material to a smoothing treatment.   
     
     
         3 . The method according to  claim 1 , which comprises:
 exposing and developing a light-sensitive material comprising a support and thereon an emulsion layer containing a silver salt emulsion to form a metallic silver portion and an insulating portion; and then   subjecting the light-sensitive material to a smoothing treatment.   
     
     
         4 . The method according to  claim 1 ,
 wherein the metallic silver portion after the smoothing treatment comprises a silver and a non-conductive polymer, and   wherein a volume ratio of Ag/the non-conductive polymer is 2/1 or more.   
     
     
         5 . The method according to  claim 1 ,
 wherein the metallic silver portion after the smoothing treatment comprises a silver and a non-conductive polymer, and   wherein a volume ratio of Ag/the non-conductive polymer is 3/1 or more.   
     
     
         6 . The method according to  claim 1 ,
 wherein 50% or more of a volume of the non-conductive polymer is occupied by gelatin.   
     
     
         7 . The method according to  claim 1 , which further comprises:
 dipping the light-sensitive material in an aqueous solution of a reducing agent between after the developing treatment and to the smoothing treatment.   
     
     
         8 . (canceled) 
     
     
         9 . (canceled) 
     
     
         10 . The method according to  claim 1 , wherein the smoothing treatment with the calender roll unit is performed at a line pressure of 1960 N/cm (200 kgf!cm) or more. 
     
     
         11 . The method according to  claim 1 ,
 wherein the smoothing treatment with the calender roll unit is performed at a line pressure of 2940 N/cm (300 kgf/cm) or more.   
     
     
         12 . The method according to  claim 1 ,
 wherein a volume ratio of Ag/a binder in the emulsion layer is 1/2 or more.   
     
     
         13 . The method according to  claim 1 ,
 wherein a volume ratio of Ag/a binder in the emulsion layer is 1/1 or more.   
     
     
         14 . The method according to  claim 1 , wherein the support has flexibility. 
     
     
         15 . The method according to  claim 1 ,
 wherein the conductive film has electromagnetic wave-shielding properties.   
     
     
         16 . A conductive film obtained by a production method according to  claim 1 . 
     
     
         17 . The conductive film according to  claim 16 , which comprises
 a support and thereon   a metal wiring pattern containing a silver at a density of 8.0 g/cm3 to 10.5 g/cm3.   
     
     
         18 . The conductive film according to  claim 17 ,
 wherein a thickness of the metal wiring pattern is from 0.5˜tm to 5 pm.   
     
     
         19 . The conductive film according to  claim 16 , which is an electromagnetic wave-shielding film. 
     
     
         20 . The conductive film according to  claim 16 , which is a printed wiring board. 
     
     
         21 . A conductive film, which comprises
 a support and thereon   a metal wiring pattern,   wherein the metal wiring pattern is subjected to a smoothing treatment which is performed with a calender roll unit at a line pressure of 980 N/cm (100 kgf/cm) or more.   
     
     
         22 . The conductive film according to  claim 21 ,
 wherein the metal wiring pattern contains a silver at a density of 8.0 g/cm3 to 10.5 g/cm3.   
     
     
         23 . The conductive film according to  claim 21 ,
 wherein a thickness of the metal wiring pattern is from 0.5 pm to 5 pm.   
     
     
         24 . The conductive film according to  claim 21 ,
 wherein a line width of the metal wiring pattern is from 0.1 pm to less than 18   
     
     
         25 . The method according to  claim 1 ,
 wherein the smoothing treatment with the calender roll unit is performed at a line pressure of 6,860 N/cm (700 kgf/cm) or less.   
     
     
         26 . The method according to  claim 25 , which further comprises:
 dipping the light-sensitive material in an aqueous solution of a reducing agent between after the developing treatment and to the smoothing treatment.