Methods and apparatuses relating to findable balls

Abstract

Golf balls and methods and systems for manufacturing golf balls. In one exemplary embodiment, a portion of a golf ball comprises a core material having a void, a semiconductor component disposed at least partially in the void, and a filler material in the void and surrounding the semiconductor component, the filler material being placed in the void in a liquid state and occupying a first volume in the liquid state and the filler material transforming into a solid state which occupies substantially the first volume. Methods for manufacturing golf balls and fixtures and apparatuses for manufacturing golf balls are also described.

1 . A method of fabricating a golf ball, the method comprising:
 applying an antenna to a core of a golf ball;   coupling a semiconductor component to the antenna;   testing the antenna and the semiconductor component for a radio frequency response;   applying a material to enclose the core and the semiconductor component and the antenna within the material if the radio frequency (RF) response is acceptable.   
     
     
         2 . A method as in  claim 1 , wherein the applying of the material comprises injection molding the material and wherein the antenna and the semiconductor component are tested again for an RF response after applying the material. 
     
     
         3 . A method as in  claim 1 , the method further comprising:
 applying an additional antenna to the core;   coupling an additional semiconductor component to the additional antenna wherein the material also encloses the additional antenna and the additional semiconductor component;   and wherein the semiconductor component is at least partially disposed in a first void with a first filler material and the additional semiconductor component is at least partially disposed in a second void with a second filler material and wherein the first filler material and the semiconductor component occupy substantially all space in the first void and the second filler material and the additional semiconductor component occupy substantially all space in the second void.   
     
     
         4 . A method as in  claim 1 , the method further comprising:
 depositing a filler material into a void on a surface of the core of a golf ball;   depositing the semiconductor component at least partially into the void;   curing the filler material at a temperature of less than about 90° F.   
     
     
         5 . A method as in  claim 4 , wherein the curing is at a temperature of about 65° F. to 75° F. and a relative humidity of about 30% to 60% and for a period of time less than about 120 minutes. 
     
     
         6 . A method as in  claim 1 , the method further comprising:
 coating the core after the semiconductor component has been coupled to the antenna with a first material which is compatible with the material which is a shell material.   
     
     
         7 . A method as in  claim 6 , wherein a connection between the semiconductor component and the antenna is cured before coating the core. 
     
     
         8 . A method as in  claim 1 , the method further comprising:
 placing the core of the golf ball into a fixture;   aligning a feature on the core relative to a registration position of the fixture, the feature having a predetermined position relative to a void on the core.   
     
     
         9 . A method as in  claim 8  further comprising:
 depositing the semiconductor component at least partially in the void; and   wherein the aligning is optically performed.   
     
     
         10 . A method as in  claim 1 , the method further comprising:
 applying a filler material into a void of the core of the golf ball, the filler material occupying a first volume when it is applied;   curing the filler material, the filler material occupying substantially the first volume after the curing.   
     
     
         11 . A method as in  claim 10  further comprising:
 depositing the semiconductor component at least partially into the void, the semiconductor component being surrounded on its sides and bottom by the filler material as the filler material is curing.   
     
     
         12 . A method as in  claim 11  further comprising:
 removing any excess of the filler material with a solvent, wherein the solvent does not effect the antenna which is an elastic conductive antenna.   
     
     
         13 . A method as in  claim 11  wherein the curing is about 70° F. 
     
     
         14 . A method as in  claim 11  wherein the filler material and the semiconductor component occupy substantially all space in the void. 
     
     
         15 . A method as in  claim 11  wherein the antenna is applied to the core by printing the antenna on the core. 
     
     
         16 . A method of  claim 1 , the method further comprising:
 coating the core material, after the semiconductor component has been coupled to the antenna, with a sealant to create a sealed core;   shipping the sealed core before applying the material to enclose the sealed core.   
     
     
         17 . A method of  claim 1 , the method further comprising:
 picking the semiconductor component with a robotic arm;   optically detecting a void on a surface of the core;   placing, with the robotic arm, the semiconductor component into the void.   
     
     
         18 . A method of  claim 1 , the method further comprising:
 attaching the core to a fixture;   aligning the core to receive the semiconductor component into a void;   attaching the semiconductor component to the void.