US2010293817A1PendingUtilityA1
Soft step top lift for shoes and method thereof
Est. expiryMay 20, 2029(~2.8 yrs left)· nominal 20-yr term from priority
A43C 13/00A43B 21/20A43B 21/42
41
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
A soft top lift member for a shoe heel wherein the top lift member is made by mixing a filler carbon material with a thermoplastic elastomer to form a filled elastomer. The filled elastomer is then formed into a top lift member for a shoe heel by using an injection molding process. The top lift member is then attached to a shoe heel. The thermoplastic elastomer can be a relatively soft thermoplastic polyurethane material and the carbon material can be a carbon powder. The filler or carbon powder is provided to enhance abrasion resistance properties.
Claims
exact text as granted — not AI-modified1 . A molded shoe top lift member comprising:
a base material including a thermoplastic elastomer; and a filler of carbon material mixed in the base material to form a substantially uniformly distributed filled elastomer.
2 . The molded shoe top lift member of claim 1 wherein said carbon material is present in the range of between about 2% and about 5% by weight of the base and filler material.
3 . The molded shoe top lift member of claim 1 wherein the carbon material is in the form of a powder.
4 . The molded shoe top lift of claim 1 wherein the particle size of the carbon material is about 2-4 microns.
5 . A method for making a shoe top lift member comprising the steps of:
providing carbon particles; mixing the carbon particles and a base material in predetermined quantities to form a substantially uniformly distributed filled elastomer; and forming the thus filled elastomer into a top lift member.
6 . The method of claim 5 wherein the carbon particles comprise about 5% by weight of the filled elastomer.
7 . The method of claim 5 wherein the carbon particles are in powder form.
8 . The method of claim 5 wherein the size of the carbon particles is in the range of about 2 microns to about 4 microns.Join the waitlist — get patent alerts
Track US2010293817A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.