Method and apparatus for thermal management of computer memory modules

Abstract

A heat spreader and method for thermal management of a computer memory module by promoting natural convection cooling of the memory module. The heat spreader includes a frame surrounding a planar body adapted to be mounted to a memory module of a computer, and a grid defined in the planar body by a plurality of uniformly distributed perforations. The perforations extend through the planar body to allow natural convention between an interior space beneath the planar body and an exterior space above the planar body.

1 . A memory module heat spreader comprising:
 a frame surrounding a planar body and adapted to be removably mounted to a computer memory module having memory components on at least a first surface thereof;   a grid defined in the planar body by a plurality of uniformly distributed perforations, the perforations extending through the planar body to allow natural convention between interior and exterior spaces of the heat spreader separated by the planar body; and   means for attaching the heat spreader to the memory module so that the memory components of the memory module are disposed within the interior space of the heat spreader and contact the planar body.   
     
     
         2 . The memory module heat spreader according to  claim 1 , wherein the perforations constitute about one-half or more of the surface area of the planar body. 
     
     
         3 . The memory module heat spreader according to  claim 1 , wherein the perforations constitute more than one-half of the surface area of the planar body. 
     
     
         4 . The memory module heat spreader according to  claim 1 , wherein the heat spreader is attached to a memory module and memory components of the memory module contact the planar body. 
     
     
         5 . The memory module heat spreader according to  claim 4 , wherein the frame and the planar body have rectangular shapes coinciding with the memory module. 
     
     
         6 . The memory module heat spreader according to  claim 1 , wherein the attaching means comprises means for securing the heat spreader to a DIMM socket retention lever of a motherboard. 
     
     
         7 . The memory module heat spreader according to  claim 1 , wherein the attaching means comprises brackets at opposite ends of the frame. 
     
     
         8 . The memory module heat spreader according to  claim 1 , wherein the planar body is formed of a metallic material. 
     
     
         9 . The memory module heat spreader according to  claim 1 , wherein the planar body, the grid, and the perforations are in combination means for inducing natural air convection through the perforations when the planar body is horizontal and a heat source is below the planar body. 
     
     
         10 . The memory module heat spreader according to  claim 1 , wherein the perforations are uniformly distributed in the planar body such that the grid is a honeycomb pattern. 
     
     
         11 . A method for thermal managing a computer memory module with the memory module heat spreader of  claim 1 , the method comprising:
 mounting the heat spreader on the memory module so that the memory components on the memory module are disposed within the interior space of the heat spreader and the planar body of the heat spreader contacts upper surfaces of the memory components; and   dissipating heat from the memory components by thermal conduction through the planar body and natural convection through the perforations by inducing natural convention between the interior space beneath the heat spreader that surrounds the memory module and the exterior space above the heat spreader.   
     
     
         12 . A memory module and heat spreader assembly comprising:
 a memory module of a computer, the memory module comprising memory components;   a heat spreader comprising a frame, a planar body surrounding the frame and contacting upper surfaces of the memory components on the memory module, a grid defined in the planar body by a plurality of uniformly distributed perforations, an interior space in which the memory components are received, and an exterior space above the planar body, the perforations extending vertically through the planar body to fluidically interconnect the interior and exterior spaces and thereby allow natural air convention between the memory module beneath the planar body and the exterior space above the planar body; and   means for removably attaching the heat spreader to the memory module so that the memory components of the memory module contact the planar body, wherein the attaching means comprises means for securing the heat spreader to a DIMM socket retention lever of a motherboard.   
     
     
         13 . The memory module and heat spreader assembly according to  claim 12 , wherein the perforations constitute more than one-half of the surface area of the planar body. 
     
     
         14 . The memory module and heat spreader assembly according to  claim 12 , wherein the frame and the planar body have rectangular shapes coinciding with the memory module.