Production method of polyhydroxyimide and positive photosensitive resin composition containing polyhydroxyimide obtained by the production method

Abstract

There is provided a simple production method of polyhydroxyimide and a positive photosensitive resin composition containing the polyhydroxyimide. A production method of a polyhydroxyimide comprising: adding an acid component that is at least one type of carboxylic acid having a pKa of 0 to 5 to a polyhydroxyimide precursor of Formula (1): (where X is a tetravalent aliphatic or aromatic group, Y is an organic group containing an aromatic group substituted with at least one OH group, and n is an integer of 1 or more); and heating the resultant mixture to a temperature of 50 to 100° C. to prepare a polyimide of Formula (2): (where X, Y and n are the same as those defined above) having a weight average molecular weight of 3,000 to 100,000.

1 . A production method of a polyhydroxyimide, comprising:
 adding an acid component that is at least one type of carboxylic acid having a pKa of 0 to 5 to a polyhydroxyimide precursor of Formula (1):   
       
         
           
           
               
               
           
         
         (where X is a tetravalent aliphatic or aromatic group, 
         Y is an organic group containing an aromatic group substituted with at least one OH group, and 
         n is an integer of 1 or more); and 
         heating the resultant mixture to a temperature of 50 to 100° C. to prepare a polyimide of Formula (2): 
       
       
         
           
           
               
               
           
         
         (where X, Y and n are the same as those defined above) 
         having a weight average molecular weight of 3,000 to 100,000. 
       
     
     
         2 . The production method of a polyhydroxyimide according to  claim 1 , wherein Y is an organic group containing a benzene ring substituted with at least one OH group. 
     
     
         3 . The production method of a polyhydroxyimide according to  claim 2 , wherein Y is an organic group containing two or more benzene rings substituted with at least one OH group. 
     
     
         4 . The production method of a polyhydroxyimide according to  claim 3 , wherein Y contains at least one type of structure selected from the structures of Formula (3) to Formula (5): 
       
         
           
           
               
               
           
         
         (where R 1  to R 27  are independently a hydrogen atom, a C 1-10  alkyl group, a C 1-10  haloalkyl group, a C 1-10  alkoxy group, a halogen atom, a nitro group, a formyl group, a cyano group, a carboxyl group, a phospho group, a sulfo group, a phenyl group which is optionally substituted with W, a naphthyl group which is optionally substituted with W, a thienyl group which is optionally substituted with W or a furyl group which is optionally substituted with W, 
         W is a C 1-10  alkyl group, a C 1-10  haloalkyl group, a C 1-10  alkoxy group, a hydroxy group, a halogen atom, a nitro group, a formyl group, a cyano group, a carboxyl group, a phospho group or a sulfo group, 
         Z 1  to Z 6  are a single bond, a C 1-10  alkylene group which is optionally substituted with W 1 , —C(O)O—, —C(O)NH—, —O—, —S—, —S(O) 2 — or —C(O)—, 
         W 1  is a C 1-10  alkyl group, a C 1-10  haloalkyl group or a C 1-10  alkoxy group, and 
         p to x are an integer of 1 or more and satisfy 2≧p+q≧1, 2≧r+s+t≧1 and 2≧u+v+w+x≧1). 
       
     
     
         5 . The production method of a polyhydroxyimide according to  claim 4 , wherein Z 1  to Z 6  are a single bond, —CH 2 —, —C(CH 3 ) 2 —, —C(CF 3 ) 2 —, —C(O)NH—, —O—, —S(O) 2 — or —C(O)—. 
     
     
         6 . The production method of a polyhydroxyimide according to  claim 1 , wherein the carboxylic acid is a carboxylic acid of Formula (6): 
       
         
           
           
               
               
           
         
         (where R 28  to R 30  are independently a hydrogen atom, a C 1-5  alkyl group, a C 1-5  haloalkyl group, a halogen atom, a nitro group, a phenyl group which is optionally substituted with W 2 , a naphthyl group which is optionally substituted with W 2 , a thienyl group which is optionally substituted with W 2  or a furyl group which is optionally substituted with W 2 , and 
         W 2  is a C 1-10  alkyl group, a C 1-10  haloalkyl group, a C 1-10  alkoxy group, a hydroxy group, a halogen atom, a nitro group, a formyl group, a cyano group, a carboxyl group, a phospho group or a sulfo group). 
       
     
     
         7 . The production method of a polyhydroxyimide according to  claim 6 , wherein the carboxylic acid of Formula (6) is a C 1-6  aliphatic carboxylic acid. 
     
     
         8 . The production method of a polyhydroxyimide according to  claim 7 , wherein in Formula (6), R 28  to R 30  are a hydrogen atom or a halogen atom. 
     
     
         9 . The production method of a polyhydroxyimide according to  claim 8 , wherein the carboxylic acid of Formula (6) is acetic acid or trifluoroacetic acid. 
     
     
         10 . The production method of a polyhydroxyimide according to  claim 1 , wherein the acid component is added in a mass 0.1 to 2 times the mass of the polyhydroxyimide precursor of Formula (1). 
     
     
         11 . The production method of a polyhydroxyimide according to  claim 1 , wherein the heating temperature is 50 to 80° C. 
     
     
         12 . A production method of a polyhydroxyimide, comprising:
 adding an acid component that is at least one type of carboxylic acid having a pKa of 0 to 5 to a polyhydroxyimide precursor having a unit structure of Formula (7):   
       
         
           
           
               
               
           
         
         (where X is a tetravalent aliphatic or aromatic group, 
         A is either an organic group containing an aromatic group substituted with at least one OH group or a group of Formula (9): 
       
       
         
           
           
               
               
           
         
         (where R 31  to R 34  are independently a hydrogen atom, a C 1-10  alkyl group, a C 1-10  haloalkyl group, a C 1-10  alkoxy group, a halogen atom, a nitro group, a formyl group, a cyano group, a carboxyl group, a phospho group, a sulfo group, a phenyl group which is optionally substituted with W 3 , a naphthyl group which is optionally substituted with W 3 , a thienyl group which is optionally substituted with W 3  or a furyl group which is optionally substituted with W 3 , 
         W 3  is a C 1-10  alkyl group, a C 1-10  haloalkyl group, a C 1-10  alkoxy group, a hydroxy group, a halogen atom, a nitro group, a formyl group, a cyano group, a carboxyl group, a phospho group or a sulfo group, 
         Z 7  to Z 9  are independently a single bond, a C 1-10  alkylene group which is optionally substituted with W 4 , —C(O)O—, —C(O)NH—, —O—, —S—, —S(O) 2 — or —C(O)—, and W 4  is a C 1-10  alkyl group, a C 1-10  haloalkyl group or a C 1-10  alkoxy group)) (with proviso that the polyhydroxyimide precursor contains a unit structure containing the organic group containing an aromatic group substituted with at least one OH group and a unit structure containing the group of Formula (9)); and 
         heating the resultant mixture to a temperature of 50 to 100° C. to prepare a polyimide of Formula (8): 
       
       
         
           
           
               
               
           
         
         (where X and A are the same as those defined above) 
         having a weight average molecular weight of 3,000 to 100,000. 
       
     
     
         13 . The production method of a polyhydroxyimide according to  claim 12 , wherein the organic group as A containing an aromatic group substituted with at least one OH group is an organic group containing a benzene ring substituted with at least one OH group. 
     
     
         14 . The production method of a polyhydroxyimide according to  claim 13 , wherein the organic group as A containing an aromatic group substituted with at least one OH group is an organic group containing two or more benzene rings substituted with at least one OH group. 
     
     
         15 . The production method of a polyhydroxyimide according to  claim 14 , wherein the organic group as A containing an aromatic group substituted with at least one OH group is an organic group containing at least one type of structure selected from structures of Formula (3) to Formula (5): 
       
         
           
           
               
               
           
         
         (where R 1  to R 27  are independently a hydrogen atom, a C 1-10  alkyl group, a C 1-10  haloalkyl group; a C 1-10  alkoxy group, a halogen atom, a nitro group, a formyl group, a cyano group, a carboxyl group, a phospho group, a sulfo group, a phenyl group which is optionally substituted with W, a naphthyl group which is optionally substituted with W, a thienyl group which is optionally substituted with W or a furyl group which is optionally substituted with W, 
         W is a C 1-10  alkyl group, a C 1-10  haloalkyl group, a C 1-10  alkoxy group, a hydroxy group, a halogen atom, a nitro group, a formyl group, a cyano group, a carboxyl group, a phospho group or a sulfo group, 
         Z 1  to Z 6  are a single bond, a C 1-10  alkylene group which is optionally substituted with W 1 , —C(O)O—, —C(O)NH—, —O—, —S—, —S(O) 2 — or —C(O)—, 
         W 1  is a C 1-10  alkyl group, a C 1-10  haloalkyl group or a C 1-10  alkoxy group, and 
         p to x are an integer of 1 or more and satisfy 2≧p+q≧1, 2≧r+s+t≧1 and 2≧u+v+w+x≧1). 
       
     
     
         16 . The production method of a polyhydroxyimide according to  claim 15 , wherein Z 1  to Z 6  are a single bond, —CH 2 —, —C(CH 3 ) 2 —, —C(CF 3 ) 2 —, —C(O)NH—, —O—, —S(O) 2 — or —C(O)—. 
     
     
         17 . The production method of a polyhydroxyimide according to  claim 12 , wherein in Formula (9), R 31  to R 34  are a methyl group, Z 7  is —O—, and Z 8  and Z 9  are a propylene group. 
     
     
         18 . The production method of a polyhydroxyimide according to  claim 12 , wherein the carboxylic acid is a carboxylic acid of Formula (6): 
       
         
           
           
               
               
           
         
         (where R 28  to R 30  are independently a hydrogen atom, a C 1-5  alkyl group, a C 1-5  haloalkyl group, a halogen atom, a nitro group, a phenyl group which is optionally substituted with W 2 , a naphthyl group which is optionally substituted with W 2 , a thienyl group which is optionally substituted with W 2  or a furyl group which is optionally substituted with W 2 , and 
         W 2  is a C 1-10  alkyl group, a C 1-10  haloalkyl group, a C 1-10  alkoxy group, a hydroxy group, a halogen atom, a nitro group, a formyl group, a cyano group, a carboxyl group, a phospho group or a sulfo group). 
       
     
     
         19 . The production method of a polyhydroxyimide according to  claim 18 , wherein the carboxylic acid of Formula (6) is a C 1-6  aliphatic carboxylic acid. 
     
     
         20 . The production method of a polyhydroxyimide according to  claim 19 , wherein in Formula (6), R 28  to R 30  are a hydrogen atom or a halogen atom. 
     
     
         21 . The production method of a polyhydroxyimide according to  claim 20 , wherein the carboxylic acid of Formula (6) is acetic acid or trifluoroacetic acid. 
     
     
         22 . The production method of a polyhydroxyimide according to  claim 12 , wherein the acid component is added in a mass 0.1 to 2 times the mass of the polyhydroxyimide precursor having a unit structure of Formula (7). 
     
     
         23 . The production method of a polyhydroxyimide according to  claim 12 , wherein the heating temperature is 50 to 80° C. 
     
     
         24 . A polyhydroxyimide obtained by the production methods of a polyhydroxyimide as claimed in  claim 1 , wherein the imidization rate is 85% or more and a hydroxy group is not acetoxylated. 
     
     
         25 . A polyhydroxyimide obtained by the production methods of a polyhydroxyimide as claimed in  claim 12 , wherein the imidization rate is 85% or more and a hydroxy group is not acetoxylated. 
     
     
         26 . A positive photosensitive resin composition comprising:
 the polyhydroxyimide as claimed in  claim 24  as an (A) component; and   a compound generating an acid by being irradiated with light as a (B) component; both of which are dissolved in a (C) solvent.   
     
     
         27 . A positive photosensitive resin composition comprising:
 the polyhydroxyimide as claimed in  claim 25  as an (A) component; and   a compound generating an acid by being irradiated with light as a (B) component; both of which are dissolved in a (C) solvent.   
     
     
         28 . The positive photosensitive resin composition according to  claim 26 , wherein the (B) component is a naphthoquinonediazide sulfonic acid ester compound. 
     
     
         29 . The positive photosensitive resin composition according to  claim 26 , wherein the (C) solvent is at least one type selected from a group consisting of an alcohol having 4 or more carbon atoms, and an alkyl ester. 
     
     
         30 . The positive photosensitive resin composition according to  claim 26 , comprising 0.01 to 100 parts by mass of the (B) component, based on 100 parts by mass of the (A) component. 
     
     
         31 . The positive photosensitive resin composition according to  claim 30 , further comprising 5 to 100 parts by mass of a crosslinkable compound as a (D) component, based on 100 parts by mass of the (A) component. 
     
     
         32 . A cured film obtained using the positive photosensitive resin composition as claimed in  claim 26 . 
     
     
         33 . An electronic part having a cured film as claimed in  claim 32 . 
     
     
         34 . An organic EL element having a cured film as claimed in  claim 32 . 
     
     
         35 . A forming method of a relief pattern comprising:
 applying the positive photosensitive resin composition as claimed in  claim 26  on a substrate;   heating and drying the composition; and   irradiating the composition with an ultraviolet ray to develop a pattern.