Method and device for supplying electrical power

Abstract

Method and device for supplying electrical power to a wafer that is at least partially submerged in a liquid. The device comprises: —a container filled with the liquid; —a transportation device comprising a wafer carrier device for transporting the wafer at least partially submerged through the liquid; —a power supply device for supplying electrical power to the wafer.

1 - 27 . (canceled) 
     
     
         28 . Device for supplying electrical power to a wafer that is at least partially submerged in a liquid, comprising:
 a liquid container filled with the liquid;   a transportation device comprising at least two wafer carrier devices for transporting the wafer at least partially submerged through the liquid from a first side of the container to a second side of the container;   a power supply device for supplying electrical power to the wafer; where the wafer carrier devices comprises holding devices comprising wedge-shaped grooves for holding edges of a wafer between two holding devices of the respective wafer carrier devices; and   where the wedge-shaped grooves comprises electrical contacts for contacting the wafer, where the electrical contacts are in electrical connection with the power supply device.   
     
     
         29 . Device according to  claim 28 , where the electrical contacts are connected to a first terminal of the power supply device and where a second terminal of the power supply device is connected to the liquid. 
     
     
         30 . Device according to  claim 29 , where the electrical contacts are spring-loaded to improve the electrical contact with the wafer. 
     
     
         31 . Device according to  claim 28 , where the holding devices comprises channels over or under the wedge-shaped grooves, for providing a force to the wafer by means of liquid flowing through the channels. 
     
     
         32 . Device according to  claim 28 , where the device further comprises a system comprising inlets, pumping means, pipings and nozzles, for pumping liquid from the inlets located below the wafers out through to the nozzles located above the wafers, via the pumping means and the pipings. 
     
     
         33 . Device according to  claim 28 , wherein the device comprises bus bars for providing contact between the wafer and the power supply. 
     
     
         34 . Device according to  claim 33 , wherein the bus bars can have different voltage potentials for different wafer positions. 
     
     
         35 . Device according to  claim 28 , wherein the device comprises a second liquid container for providing a reverse-plating process to remove deposited metal. 
     
     
         36 . Method for supplying electrical power to a wafer that is at least partially submerged in a liquid, comprising the following steps:
 a) holding the wafer between two holding devices by receiving the ends of the wafer in a wedge-shaped opening of the respective holding devices;   b) transporting the wafer at least partially submerged through the liquid by means of a transportation device from a first side of the container to a second side of the container;   c) supplying an electrical power to the wafer by means of electrical contacts localized in or near the wedge-shaped grooves.   
     
     
         37 . Method according to  claim 36 , further comprising the step of providing that the electrical contacts are connected to a first terminal of the power supply and a second terminal of the power supply device is connected to the liquid. 
     
     
         38 . Method according to  claim 36 , further comprising the step of providing the electrical contacts as spring-loaded electrical contacts to improve the electrical contact with the wafer. 
     
     
         39 . Method according to  claim 36 , further comprising the step of providing the holding devices with channels over or under the wedge-shaped grooves, for providing a force to the wafer by means of liquid flowing through the channels. 
     
     
         40 . Method according to  claim 36 , further comprising the step of providing a spraying arrangement for pumping liquid through nozzles directed towards the surface of the wafer. 
     
     
         41 . Method according to  claim 36 , further comprising the step of providing bus bars for providing contact between the wafer and the power supply. 
     
     
         42 . Method according to  claim 41 , further comprising the step of providing the bus bars with different voltage potentials for different wafer positions. 
     
     
         43 . Method according to  claim 36 , further comprising the step of providing a second liquid container for providing a reverse-plating process to remove deposited metal. 
     
     
         44 . Method according to  claim 36 , further comprising providing lights situated either submerged in the liquid or above the wafers for enabling so called light induced plating.