US2010313764A1PendingUtilityA1

Apparatus and Method for Collecting Residual Products for FPD and Semiconductor

Assignee: LEE ANG-GOOPriority: Apr 29, 2005Filed: Aug 23, 2010Published: Dec 16, 2010
Est. expiryApr 29, 2025(expired)· nominal 20-yr term from priority
H10P 95/00B01D 53/002B01D 2258/0216
34
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Claims

Abstract

An apparatus for efficiently collecting reaction by-products in exhaust gases of a semiconductor processing or flat panel display processing device is provided. The collection apparatus includes a heating section connected to a process chamber of the semiconductor processing or flat panel display processing device. The heating section is designed to preheat the reaction by-products to prevent or reduce liquefaction of the reaction by-products. A by-product pile up section then rapidly cools the heated reaction by-products to convert the same into a solid form.

Claims

exact text as granted — not AI-modified
1 - 8 . (canceled) 
     
     
         9 . An apparatus for collecting reaction by-products in exhaust gases of a semiconductor processing or flat panel display processing device, comprising:
 a process chamber forming a thin film;   a heating section, connected to the process chamber;   a by-product pile up section connected to the heating section and comprising a body enclosing a plurality of cooling plates, wherein:
 the plurality of cooling plates are removable for cleaning; 
 each cooling plate has a through hole and at least one coolant path therein; and 
 the coolant path is coupled to the body; and 
   a pump connected to the by-product pile up section.   
     
     
         10 . An apparatus for collecting reaction by-products in exhaust gases of a semiconductor processing or flat panel display processing device, comprising:
 a heating section, connected to a process chamber of the semiconductor processing or flat panel display processing device, wherein heat is applied to reduce the liquefaction of the reaction by-products;   a by-product pile up section connected to the heating section, the by-product pile up section including:
 at least one cooling plate having a through hole and a coolant section operable to cool the heated reaction by-products for conversion to a solid form, the coolant section having a supply port and an exhaust port; 
 a supply passage and an exhaust passage coupled to the supply and exhaust ports for the supply and exhaust of coolant, the supply and exhaust passages being on the side located in the by-product pile up section; and 
 a shaft protruding in the center of the by-product pile up section to receive the cooling plate through the through hole. 
   
     
     
         11 . The apparatus according to  claim 9 , wherein:
 the at least one cooling plate includes at least four cooling plates; and   the supply and exhaust ports of the even numbered cooling plates are disposed to receive the coolant from one side of the by-product pile up section while the supply and exhaust ports of the odd numbered cooling plates are disposed to receive the coolant from the other side of the by-product pile up section.

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