Method for making camera modules and camera module made thereby

Abstract

A method for making camera modules includes the steps of: a) providing a wafer including an array of sensor chips; b) mounting a plurality of lens assemblies on the sensor chips, respectively, thereby defining a plurality of intersecting spacing grooves among the lens assemblies; c) forming a substrate layer by filling in the spacing grooves with a resin material; and d) cutting the wafer and the substrate layer along intersecting cutting lines each extending along one of the spacing grooves and each intervening the lens assemblies, the substrate layer being divided into a plurality of barrels respectively surrounding the lens assemblies. A camera module made by the method is also disclosed.

1 . A lens module, comprising:
 a sensor chip having a first surface and a second surface opposite to said first surface;   a lens assembly mounted on said first surface of said sensor chip and having a cross-section smaller than that of said sensor chip so that said first surface of said sensor chip has an excess surface portion around said lens assembly; and   a barrel mounted on said excess surface portion of said first surface of said sensor chip and surrounding said lens assembly, said barrel having an outer lateral surface flush with a peripheral end of said sensor chip.   
     
     
         2 . The lens module as claimed in  claim 1 , further comprising a cover mounted on said barrel and said lens assembly, and having a light-transmissive throughhole. 
     
     
         3 . The lens module as claimed in  claim 2 , wherein said cover has an outer lateral surrounding surface substantially flush with the outer lateral surface of said barrel and with said peripheral end of said sensor chip, said barrel being mounted between said cover and said sensor chip. 
     
     
         4 . The lens modules as claimed in  claim 1 , further comprising a plurality of conductive blocks mounted on said second surface of said sensor chip. 
     
     
         5 . lens module as claimed in  claim 4 , wherein each of said conductive blocks is selected from the group consisting of a solder ball and a conductive bump.