Memory card

Abstract

A memory card and method for fabricating the same are disclosed, which includes mounting and electrically connecting at least a chip to a circuit board unit having a predefined shape of a memory card; attaching a thin film to the surface of the circuit board unit opposed to the surface with the chip mounted thereon; covering the circuit board unit and the thin film by a mold so as to form a mold cavity having same shape as the circuit board unit but bigger size; filling a packaging material in the mold cavity so as to form an encapsulant encapsulating the chip and outer sides of the circuit board unit, thus integrally forming a memory card having the predefined shape. The present invention eliminates the need to perform a shape cutting process by using water jet or laser as in the prior art, thus reducing the fabricating cost and improving the fabricating yield.

1 - 15 . (canceled) 
     
     
         16 . A memory card, comprising:
 a circuit board unit having a predefined shape of a memory card;   at least a chip electrically connected to the circuit board unit; and   an encapsulant formed by transfer molding and having same shape as the circuit board unit but bigger size, the encapsulant encapsulating the chip and outer sides of the circuit board unit.   
     
     
         17 . The memory card of  claim 16 , wherein the circuit board unit has a first surface to be mounted with the chip, a second surface opposed to the first surface, and conductive through holes penetrating the first and second surfaces. 
     
     
         18 . The memory card of  claim 17 , wherein the first surface of the circuit board unit has circuit pattern connecting the conductive through holes, and the second surface of the circuit board unit has electrical terminals respectively connecting the conductive through holes. 
     
     
         19 . The memory card of  claim 18 , wherein the chip is electrically connected to the circuit pattern of the first surface of the circuit board unit by one of the methods consisting of flip chip and wire bonding. 
     
     
         20 . The memory card of  claim 17 , wherein the encapsulant encapsulates the chip and the outer sides and the first surface of the circuit board unit, but the encapsulant does not encapsulate the second surface of the circuit board unit.