Thermal pyrolytic graphite laminates with vias

Abstract

A thermally conductive laminate comprising a first substrate, a second substrate, and a performance layer disposed between the first substrate and the second substrate. The performance layer comprising thermal pyrolytic graphite (TPG) and vias. The TPG board surface and the vias may be at least partially filled with a material comprising at least one of thermally conductive epoxy, soldering metal/alloy or brazing metal/alloy. In addition, the thermally conductive laminate may not contain a framing structure surrounding the performance layer.

1 . A thermally conductive laminate comprising:
 a first substrate;   a second substrate; and   a performance layer disposed between said first substrate and said second substrate, said performance layer comprising thermal pyrolytic graphite having a plurality of vias wherein the volume % of said vias in said performance layer rangers from about 0.1% to about 20%.   
     
     
         2 . The thermally conductive laminate of  claim 1 , wherein said vias are at least partially filled with a bonding material. 
     
     
         3 . The thermally conductive laminate of  claim 2 , wherein said bonding material is chosen from an organic adhesive, an inorganic adhesive, a soldering metal, a soldering metal alloy, a brazing metal, a brazing metal alloy or a combination of two or more thereof. 
     
     
         4 . The thermally conductive laminate of  claim 3 , wherein the bonding material comprises a thermally conductive epoxy. 
     
     
         5 . The thermally conductive laminate of  claim 1 , wherein said thermal pyrolytic graphite surface is coated with a material comprising at least one of a thermally conductive epoxy, a soldering metal, a soldering metal alloy, a brazing metal, or a brazing metal alloy. 
     
     
         6 . The thermally conductive laminate of  claim 1 , wherein the spacing of said vias ranges from about 0.5 mm to about 125 mm. 
     
     
         7 . The thermally conductive laminate of  claim 1 , wherein the spacing of said vias ranges from about 1 mm to about 25 mm. 
     
     
         8 . The thermally conductive laminate of  claim 1 , wherein the first and second substrates are metal foils independently chosen from copper, aluminum, tungsten, molybdenum, nickel, iron, tin, silver, gold, and alloys of two or more thereof 
     
     
         9 . The thermally conductive laminate of  claim 1 , wherein at least one of said first substrate and said second substrate comprises copper foil. 
     
     
         10 . The thermally conductive laminate of  claim 1 , wherein at least one of said first substrate and said second substrate comprises aluminum foil. 
     
     
         11 . The thermally conductive laminate of  claim 1 , wherein the diameter of said vias ranges from about 0.1 mm to about 5 mm. 
     
     
         12 . The thermally conductive laminate of  claim 1 , wherein said performance layer is surrounded by a framing structure. 
     
     
         13 . A heat transfer device comprising:
 a thermally conductive laminate comprising:
 a first substrate; 
 a second substrate; and 
 a performance layer disposed between said first substrate and said second substrate, said performance layer comprising thermal pyrolytic graphite having a plurality of vias disposed therein; wherein said heat transfer device is free of a framing structure surrounding said performance layer. 
   
     
     
         14 . The thermally conductive laminate of  claim 13 , wherein said vias are at least partially filled with a bonding material. 
     
     
         15 . The thermally conductive laminate of  claim 14 , wherein said bonding material is chosen from an organic adhesive, an inorganic adhesive, a soldering metal, a soldering metal alloy, a brazing metal, a brazing metal alloy or a combination of two or more thereof. 
     
     
         16 . The thermally conductive laminate of  claim 15 , wherein the bonding material comprises a thermally conductive epoxy. 
     
     
         17 . The thermally conductive laminate of  claim 13 , wherein the volume % of said vias in said performance layer ranges from about 0.01% to about 40%. 
     
     
         18 . The thermally conductive laminate of  claim 13 , wherein the volume % of said vias in said performance layer ranges from about 0.1% to about 20%. 
     
     
         19 . The thermally conductive laminate of  claim 13 , wherein the spacing of said vias ranges from about 0.5 mm to about 125 mm. 
     
     
         20 . The thermally conductive laminate of  claim 13 , wherein the spacing of said vias ranges from about 1 mm to about 25 mm. 
     
     
         21 . The thermally conductive laminate of  claim 13 , wherein said first and second substrates comprise a material chosen from copper, aluminum, tungsten, molybdenum, nickel, iron, tin, silver, gold, and alloys of two or more thereof. 
     
     
         22 . The thermally conductive laminate of  claim 13 , wherein at least one of said first substrate and said second substrate comprises copper foil. 
     
     
         23 . The thermally conductive laminate of  claim 13 , wherein at least one of said first substrate and said second substrate comprises aluminum foil. 
     
     
         24 . The thermally conductive laminate of  claim 13 , wherein the diameter of said vias ranges from about 0.1 mm to about 5 mm. 
     
     
         25 . A heat transfer structure comprising a plurality of thermally conductive laminates of  claim 13  bonded together.