Chemical solution for selectively treating or removing a deteriorated layer at a surface of an organic film, and method for using such
Abstract
A method for forming an organic mask, includes: permeating an organic solvent into an organic pattern formed on a base film and containing at least one kind of organic material, by contacting the organic pattern with the organic solvent; and thereby, partially or entirely decreasing original adhesion strength between the base film and the organic pattern. A heat treatment may be conducted after contacting to adjust the adhesion strength. Using the organic pattern as a mask, isotropic etching is conducted. As a result, a desired taper angle of the etched base film can be achieved with high accuracy. The taper angle of the etched base film is adjustable by controlling the adhesion strength through the heat treatment.
Claims
exact text as granted — not AI-modified1 . A chemical solution which selectively treats, or removes a deteriorated layer at a surface of organic film, while leaving an organic film, and contains at least one kind of amines with concentration of 0.05 wt % to 10 wt %
2 . A chemical solution according to claim 1 , wherein the chemical solution contains at least one kind of amines with concentration of 0.05 wt % to 3 wt %
3 . A chemical solution according to claim 1 , wherein the at least one kind of amines is one selected from a group of monoethylamine, diethylamine, triethylamine, monoisopropylamine, diisopropylamine, monobutylamine, dibutylamine, tributylamine, hydroxylamine, diethylhydroxylamine, diethylhydroxylamine anhydride, pyridine, and picoline.
4 . A chemical solution according to claim 1 , wherein the at least one kind of amines is mixed with water.
5 . A chemical solution according to claim 1 , further containing an antiseptic agent.
6 . A method for using a chemical solution which selectively treats, or removes a deteriorated layer at a surface of organic film, while leaving an organic film.
7 . A method for using a chemical solution according to claim 6 , wherein the chemical solution contains at least one kind of amines with concentration of 0.05 wt % to 10 wt %
8 . A method for using a chemical solution according to claim 7 , wherein the chemical solution contains at least one kind of amines with concentration of 0.05 wt % to 3 wt %
9 . A method for using a chemical solution according to claim 8 , wherein the at least one kind of amines is one selected from a group of monoethylamine, diethylamine, triethylamine, monoisopropylamine, diisopropylamine, monobutylamine, dibutylamine, tributylamine, hydroxylamine, diethylhydroxylamine, diethylhydroxylamine anhydride, pyridine, and picoline.
10 . A method for using a chemical solution according to claim 7 , wherein the at least one kind of amines is mixed with water.
11 . A method for using a chemical solution according to claim 7 , further containing an antiseptic agent.
12 . A chemical solution according to claim 2 , wherein the at least one kind of amines is one selected from a group of monoethylamine, diethylamine, triethylamine, monoisopropylamine, diisopropylamine, monobutylamine, dibutylamine, tributylamine, hydroxylamine, diethylhydroxylamine, diethylhydroxylamine anhydride, pyridine, and picoline.
13 . A chemical solution according to claim 2 , wherein the at least one kind of amines is mixed with water.
14 . A chemical solution according to claim 2 , further containing an antiseptic agent.
15 . A chemical solution according to claim 3 , further containing an antiseptic agent.
16 . A chemical solution according to claim 4 , further containing an antiseptic agent.
17 . A method for using a chemical solution according to claim 9 , wherein the at least one kind of amines is mixed with water.
18 . A method for using a chemical solution according to claim 8 , further containing an antiseptic
19 . A method for using a chemical solution according to claim 9 , further containing an antiseptic
20 . A method for using a chemical solution according to claim 10 , further containing an antisepticCited by (0)
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