US2010327218A1PendingUtilityA1

Chemical solution for selectively treating or removing a deteriorated layer at a surface of an organic film, and method for using such

46
Assignee: NEC LCD TECHNOLOGIES LTDPriority: Apr 14, 2004Filed: Aug 30, 2010Published: Dec 30, 2010
Est. expiryApr 14, 2024(expired)· nominal 20-yr term from priority
Inventors:Shusaku Kido
H10P 72/0418H10P 50/71H10P 76/204
46
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A method for forming an organic mask, includes: permeating an organic solvent into an organic pattern formed on a base film and containing at least one kind of organic material, by contacting the organic pattern with the organic solvent; and thereby, partially or entirely decreasing original adhesion strength between the base film and the organic pattern. A heat treatment may be conducted after contacting to adjust the adhesion strength. Using the organic pattern as a mask, isotropic etching is conducted. As a result, a desired taper angle of the etched base film can be achieved with high accuracy. The taper angle of the etched base film is adjustable by controlling the adhesion strength through the heat treatment.

Claims

exact text as granted — not AI-modified
1 . A chemical solution which selectively treats, or removes a deteriorated layer at a surface of organic film, while leaving an organic film, and contains at least one kind of amines with concentration of 0.05 wt % to 10 wt % 
     
     
         2 . A chemical solution according to  claim 1 , wherein the chemical solution contains at least one kind of amines with concentration of 0.05 wt % to 3 wt % 
     
     
         3 . A chemical solution according to  claim 1 , wherein the at least one kind of amines is one selected from a group of monoethylamine, diethylamine, triethylamine, monoisopropylamine, diisopropylamine, monobutylamine, dibutylamine, tributylamine, hydroxylamine, diethylhydroxylamine, diethylhydroxylamine anhydride, pyridine, and picoline. 
     
     
         4 . A chemical solution according to  claim 1 , wherein the at least one kind of amines is mixed with water. 
     
     
         5 . A chemical solution according to  claim 1 , further containing an antiseptic agent. 
     
     
         6 . A method for using a chemical solution which selectively treats, or removes a deteriorated layer at a surface of organic film, while leaving an organic film. 
     
     
         7 . A method for using a chemical solution according to  claim 6 , wherein the chemical solution contains at least one kind of amines with concentration of 0.05 wt % to 10 wt % 
     
     
         8 . A method for using a chemical solution according to  claim 7 , wherein the chemical solution contains at least one kind of amines with concentration of 0.05 wt % to 3 wt % 
     
     
         9 . A method for using a chemical solution according to  claim 8 , wherein the at least one kind of amines is one selected from a group of monoethylamine, diethylamine, triethylamine, monoisopropylamine, diisopropylamine, monobutylamine, dibutylamine, tributylamine, hydroxylamine, diethylhydroxylamine, diethylhydroxylamine anhydride, pyridine, and picoline. 
     
     
         10 . A method for using a chemical solution according to  claim 7 , wherein the at least one kind of amines is mixed with water. 
     
     
         11 . A method for using a chemical solution according to  claim 7 , further containing an antiseptic agent. 
     
     
         12 . A chemical solution according to  claim 2 , wherein the at least one kind of amines is one selected from a group of monoethylamine, diethylamine, triethylamine, monoisopropylamine, diisopropylamine, monobutylamine, dibutylamine, tributylamine, hydroxylamine, diethylhydroxylamine, diethylhydroxylamine anhydride, pyridine, and picoline. 
     
     
         13 . A chemical solution according to  claim 2 , wherein the at least one kind of amines is mixed with water. 
     
     
         14 . A chemical solution according to  claim 2 , further containing an antiseptic agent. 
     
     
         15 . A chemical solution according to  claim 3 , further containing an antiseptic agent. 
     
     
         16 . A chemical solution according to  claim 4 , further containing an antiseptic agent. 
     
     
         17 . A method for using a chemical solution according to  claim 9 , wherein the at least one kind of amines is mixed with water. 
     
     
         18 . A method for using a chemical solution according to  claim 8 , further containing an antiseptic 
     
     
         19 . A method for using a chemical solution according to  claim 9 , further containing an antiseptic 
     
     
         20 . A method for using a chemical solution according to  claim 10 , further containing an antiseptic

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.