LED bulb

Abstract

Semiconductor, e.g. LED, lighting device. The device cools a housing on which the LEDs are coupled.

1 . A semiconductor light source device, comprising:
 a heat conducting material, having an outer surface; and plural light emitting semiconductor elements, attached to said outer surface of said heat conducting material which is exposed to the environment, and connected to be commonly energized by an energizing current.   
     
     
         2 . A device as in  claim 1 , wherein said heat conducting material has a curved shape on which said elements are attached. 
     
     
         3 . A device as in  claim 2 , wherein said elements are attached to an outer surface of a shape which forms an inside cavity. 
     
     
         4 . A device as in  claim 3 , further comprising an active cooling device in said inside cavity. 
     
     
         5 . A device as in  claim 3 , wherein said shape is a globe. 
     
     
         6 . A device as in  claim 1 , wherein said semiconductor elements are connected to said heat conducting material by epoxy. 
     
     
         7 . A device as in  claim 1 , wherein said heat conducting material is electrically conducting. 
     
     
         8 . A semiconductor light source device, comprising:
 a housing, formed to have an outer surface that surrounds an inner area;   plural light emitting semiconductor elements, attached to said outer surface of said housing, and connected to be commonly energized by an energizing current; and   a cooling device providing a cooling effect to said inner area.   
     
     
         9 . A device as in  claim 8 , wherein said housing is formed of a heat conductive material. 
     
     
         10 . A device as in  claim 9 , wherein said housing is spherical. 
     
     
         11 . A device as in  claim 8 , wherein said housing includes openings on its inside, and said openings couple to ambient air. 
     
     
         12 . A device as in  claim 11 , further comprising a fan which forces air through said openings. 
     
     
         13 . A device as in  claim 8 , wherein said semiconductor elements are connected to said heat conducting material by epoxy. 
     
     
         14 . A device as in  claim 8 , further comprising a semiconductor cooler which cools said inner area. 
     
     
         15 . A device as in  claim 14 , wherein said semiconductor cooler exhausts heat via it electrical connection. 
     
     
         16 . A method comprising:
 coupling semiconductor lighting elements to an outer surface of a housing; and   cooling an inside of the housing.   
     
     
         17 . A method as in  claim 16 , wherein said inside is hollow. 
     
     
         18 . A method as in  claim 16 , wherein said lighting elements are LEDs. 
     
     
         19 . A method as in  claim 16 , wherein said cooling comprises using a semiconductor based cooler and exhausting heat from the cooler via an electrical connection.