Method of encapsulating an environmentally sensitive device

Abstract

Methods of encapsulating an environmentally sensitive device. The methods involve temporarily laminating a flexible substrate to a rigid support using a reversible adhesive for processing, reversing the reversible adhesive, and removing the device from the rigid support.

1 . A method of encapsulating an environmentally sensitive device comprising:
 providing a flexible substrate in discrete sheet form;   temporarily laminating the flexible substrate adjacent to a rigid support;   optionally applying a first barrier stack adjacent to the flexible substrate, the first barrier stack comprising at least one barrier layer and at least one decoupling layer;   applying the environmentally sensitive device adjacent to the flexible substrate;   applying a second barrier stack adjacent to the environmentally sensitive device, the second barrier stack comprising at least one barrier layer and at least one decoupling layer, the environmentally sensitive device being encapsulated between the substrate and the second barrier stack, the substrate and the second barrier stack forming a seal, or between the first barrier stack and the second barrier stack, the first and second barrier stacks forming a seal; and   removing the encapsulated environmentally sensitive device from the rigid support.   
     
     
         2 . The method of  claim 1  wherein the flexible substrate is temporarily laminated to the rigid support with a reversible adhesive selected from heat activated adhesive, pressure sensitive adhesive, UV activated adhesive, or combinations thereof. 
     
     
         3 . The method of  claim 1  wherein the flexible substrate is cut into the discrete sheet form before the flexible substrate is laminated adjacent to the rigid support. 
     
     
         4 . The method of  claim 1  wherein the flexible substrate is cut into the discrete sheet form after the flexible substrate is laminated adjacent to the rigid support. 
     
     
         5 . The method of  claim 1  wherein the flexible substrate is cut into the discrete sheet form and wherein the first barrier stack is applied before the flexible substrate is cut into the discrete sheet form. 
     
     
         6 . The method of  claim 1  wherein the flexible substrate is cut into the discrete sheet form and wherein the first barrier stack is applied after the flexible substrate is cut into the discrete sheet form. 
     
     
         7 . The method of  claim 1  wherein the first barrier stack is applied before the flexible substrate is laminated adjacent to the rigid support. 
     
     
         8 . The method of  claim 1  wherein the first barrier stack is applied after the flexible substrate is laminated adjacent to the rigid support. 
     
     
         9 . The method of  claim 1  further comprising separating the encapsulated environmentally sensitive device on the flexible substrate from another encapsulated environmentally sensitive device on the flexible substrate. 
     
     
         10 . The method of  claim 1  wherein the first barrier stack is applied using a mask. 
     
     
         11 . The method of  claim 1  wherein the second barrier stack is applied using a mask. 
     
     
         12 . The method of  claim 1  wherein the first barrier stack is sealed at an edge. 
     
     
         13 . The method of  claim 1  wherein the second barrier stack is sealed at an edge. 
     
     
         14 . The method of  claim 1  further comprising applying a functional layer adjacent to the flexible substrate. 
     
     
         15 . The method of  claim 1  wherein the first barrier stack is applied on a side of the flexible substrate opposite the environmentally sensitive device. 
     
     
         16 . The method of  claim 1  wherein applying a second barrier stack adjacent to the environmentally sensitive device comprises depositing the second barrier stack adjacent to the environmentally sensitive device. 
     
     
         17 . The method of  claim 16  wherein depositing the second barrier stack adjacent to the environmentally sensitive device comprises vacuum depositing the second barrier stack adjacent to the environmentally sensitive device. 
     
     
         18 . The method of  claim 1  wherein applying a second barrier stack adjacent to the environmentally sensitive device comprises laminating the second barrier stack adjacent to the environmentally sensitive device. 
     
     
         19 . The method of  claim 16  wherein the second barrier stack is laminated adjacent to the environmentally sensitive device using heat, adhesive, or combinations thereof. 
     
     
         20 . The method of  claim 1  further comprising applying an array of thin film transistors before the environmentally sensitive device is applied. 
     
     
         21 . The product produced by the method of  claim 1 . 
     
     
         22 . A method of encapsulating an environmentally sensitive device comprising:
 providing a flexible substrate in discrete sheet form;   temporarily laminating the flexible substrate adjacent to a rigid support;   applying a first barrier stack adjacent to the flexible substrate, the first barrier stack comprising at least one barrier layer and at least one decoupling layer;   applying the environmentally sensitive device adjacent to the flexible substrate;   applying a sheet of barrier material adjacent to the environmentally sensitive device to encapsulate the environmentally sensitive device between the first barrier stack and the sheet of barrier material, the first barrier stack and the sheet of barrier material forming a seal; and   removing the encapsulated environmentally sensitive device from the rigid support.