Heat dissipating board structure and method of manufacturing the same

Abstract

A heat dissipating board structure includes a heat dissipating board body having a first face with at least one groove; and at least one heat pipe correspondingly received in the at least one groove to flush with the first face. To manufacture the heat dissipating board structure, first provide at least one heat pipe and a heat dissipating board body; then, form at least one groove on a first face of the board body, place the heat pipe in the groove, and press the board body with a press machine to associate the heat pipe with the groove while flatten a top of the heat pipe; and finally, flush the heat pipe with the first face by removing extra material of the heat pipe that is protruded from the first face. The completed heat dissipating board structure provides upgraded heat dissipation efficiency and eliminates the problem of thermal resistance.

1 . A heat dissipating board structure, comprising:
 a heat dissipating board body having at least one first face, on which at least one groove is formed; and the groove including a closed side and an open side; and   at least one heat pipe having a contact face and an embedded face; the embedded face being correspondingly associated with the closed side of the groove, and the contact face being correspondingly located at the open side of the groove to flush with the first face of the board body, such that the heat pipe is embedded in the groove.   
     
     
         2 . The heat dissipating board structure as claimed in  claim 1 , further comprising a heat-conducting bonding medium applied between the embedded face of the heat pipe and the groove. 
     
     
         3 . The heat dissipating board structure as claimed in  claim 2 , wherein the heat-conducting bonding medium is solder paste. 
     
     
         4 . The heat dissipating board structure as claimed in  claim 1 , wherein the embedded face has a cross sectional shape the same as that of the closed side of the groove. 
     
     
         5 . The heat dissipating board structure as claimed in  claim 1 , wherein the contact face is a flat face. 
     
     
         6 . A method of manufacturing a heat dissipating board structure, comprising the following steps:
 providing at least one heat pipe and at least one heat dissipating board body;   forming at least one groove on a first face of the heat dissipating board body;   correspondingly placing the at least one heat pipe in the at least one groove;   associating the heat pipe with the groove and applying a force against the first face of the heat dissipating board body to flatten a top of the heat pipe; and   removing extra material of the heat pipe that is protruded from the first face, so that the top of the heat pipe is flush with the first face.   
     
     
         7 . The method of manufacturing a heat dissipating board structure as claimed in  claim 6 , wherein, in the associating step, the heat pipe is forced into the groove through pressing. 
     
     
         8 . The method of manufacturing a heat dissipating board structure as claimed in  claim 6 , wherein the step of removing extra material is performed by a cut operation selected from the group consisting of milling and grinding. 
     
     
         9 . The method of manufacturing a heat dissipating board structure as claimed in  claim 6 , wherein, before the step of placing the heat pipe in the groove, a heat-conducting bonding medium is first applied in the groove. 
     
     
         10 . The method of manufacturing a heat dissipating board structure as claimed in  claim 9 , wherein the heat-conducting bonding medium is solder paste. 
     
     
         11 . The method of manufacturing a heat dissipating board structure as claimed in  claim 6 , wherein, in the associating step, the heat pipe is welded to the groove. 
     
     
         12 . The method of manufacturing a heat dissipating board structure as claimed in  claim 6 , wherein, in the associating step, the heat pipe is associated with the groove through ultrasonic bonding. 
     
     
         13 . The method of manufacturing a heat dissipating board structure as claimed in  claim 9 , wherein, in the associating step, the heat pipe is welded to the groove. 
     
     
         14 . The method of manufacturing a heat dissipating board structure as claimed in  claim 9 , wherein, in the associating step, the heat pipe is associated with the groove through ultrasonic bonding.