Heat sink device

Abstract

A heat sink is provided. The heat sink contains a first vapor chamber section having a top surface and a bottom surface that is in thermal contact with a heat source, a second vapor chamber section that extends vertically from the top surface of the first vapor chamber section, and heat-dissipating fins that are attached to the second vapor chamber section. The first and second vapor sections are connected to each other forming a continuous vapor chamber space.

1 . A heat sink comprising:
 a first vapor chamber section having an upper surface and a lower surface;   a second vapor chamber section extending vertically fro the upper surface of said first vapor chamber section; and   heat-dissipating fins extending horizontally from said second vapor chamber section,   wherein said lower surface is in thermal contact with a heat source and wherein said first and second vapor sections are connected to each other, forming a continuous vapor chamber space.   
     
     
         2 . The heat sink of  claim 1 , wherein said second vapor chamber section is in the form a hollow-centered sidewall. 
     
     
         3 . The heat sink of  claim 1 , wherein said second vapor chamber section is in the form a hollow-centered center column. 
     
     
         4 . The heat sink of  claim 3 , wherein said hollow-centered center column is in the form of a free-standing column. 
     
     
         5 . The heat sink of  claim 3 , wherein said hollow-centered center column is in the form of a center wall. 
     
     
         6 . The heat sink of  claim 1 , wherein said first and second vapor chambers comprise a porous material. 
     
     
         7 . The heat sink of  claim 6 , wherein said porous material comprises sintered powder wick. 
     
     
         8 . The heat sink of  claim 7 , wherein said sintered powder wick comprises a material selected from the group consisting of carbon, tungsten, copper, aluminum, magnesium, nickel, gold, silver, aluminum oxide, and beryllium oxide. 
     
     
         9 . The heat sink of  claim 8 , wherein said sintered powder wick is sintered copper wick. 
     
     
         10 . The heat sink of  claim 1 , wherein said first and second vapor chambers comprise a material of high thermal conductivity. 
     
     
         11 . The heat sink of  claim 10 , wherein the material of high thermal conductivity comprises copper or aluminum. 
     
     
         12 . The heat sink of  claim 1 , wherein said heat dissipating fins are planar-shaped and are attached in horizontal arrangement to said second vapor chamber section. 
     
     
         13 . The heat sink of  claim 12 , wherein said heat dissipating fins comprises a material of high thermal conductivity, 
     
     
         14 . The heat sink of  claim 13 , wherein the material of high thermal conductivity comprises copper or aluminum. 
     
     
         15 . The heat sink of  claim 1 , wherein said first vapor chamber section contains a working fluid. 
     
     
         16 . The heat sink of  claim 15 , wherein said working fluid is water. 
     
     
         17 . A heat sink comprising:
 a hollow-centered base having a top surface and a bottom surface, wherein said bottom surface is in thermal contact with a heat source;   two hollow-centered sidewalls located on two opposite sides of the base and extending upwardly from the top surface of the base; and   one or more hollow-centered center columns located between the two sidewalls and extending upwardly from the top surface of the base,   wherein the hollow centers of said base, said sidewalls and said one or more center columns are connected to each other forming a continuous vapor chamber space, and wherein said sidewalls and said center columns comprise fins for heat dissipation.   
     
     
         18 . The heat sink of  claim 16 , wherein said fins have a planar shape and extend in directions parallel to said top surface of said hollow-centered base. 
     
     
         19 . A heat sink comprising:
 a planar-shaped first vapor chamber having a first surface and a second surface, wherein said first surface is opposite to said second surface and is in contact with a heat source;   a second vapor chamber formed on said second surface, said second vapor chamber is connected to said first vapor chamber thus forming a continuous vapor chamber space; and   a plurality of planar-shaped heat dissipating fins extending from said second vapor chamber.   
     
     
         20 . The heat sink of  claim 19 , wherein said second vapor chamber is a wall-like vapor chamber.