Semiconductor device and method for manufacturing the same

Abstract

A method includes: mounting a plurality of semiconductor elements on a substrate having wirings; connecting electrically electrodes of the semiconductor elements and the wirings; sealing the semiconductor elements with a resin, which is carried out by bringing a thermal conductor having a concavity and the substrate to be in contact with each other so that the semiconductor elements are positioned within the concavity and by filling the concavity with the resin; and separating respective semiconductor elements 1 . In the resin-sealing step, in a state where the thermal conductor is arranged with its concavity facing up and the concavity of the thermal conductor is filled with a liquid resin, the semiconductor elements are clipped in the liquid resin in the concavity and the liquid resin is solidified. Due to these steps, a semiconductor device can be manufactured without experiencing troubles such as short circuit of the metal thin wires or imperfect filling of resin during the manufacturing steps, and thus semiconductor devices with stable quality can be manufactured.

1 .- 24 . (canceled) 
     
     
         25 . A semiconductor device comprising:
 a semiconductor element;   a substrate on which the semiconductor element is mounted;   a thermal conductor; and   a sealing resin provided to spacing between the substrate and the thermal conductor so as to seal the semiconductor element,   the thermal conductor is bonded to the surface of the sealing resin so as to cover the sealing resin.   
     
     
         26 . The semiconductor device according to  claim 25 , wherein the thermal conductor covers the entire surface of the sealing resin. 
     
     
         27 . The semiconductor device according to  claim 25 , wherein the sealing resin is exposed from a surface composed of the side face of the substrate and the side face of the thermal conductor. 
     
     
         28 . The semiconductor device according to  claim 27 , wherein the sealing resin is exposed from two side-faces opposed to each other. 
     
     
         29 . The semiconductor device according to  claim 27 , wherein the sealing resin is exposed from all of the side faces. 
     
     
         30 . The semiconductor device according to  claim 25 , wherein an electrode of the semiconductor element and wirings of the substrate are connected electrically to each other through metal thin wires. 
     
     
         31 . The semiconductor device according to  claim 25 , wherein an electrode of the semiconductor element and wirings of the substrate are connected electrically to each other via bumps. 
     
     
         32 . The semiconductor device according to  claim 31 , wherein a surface of the semiconductor element opposite to the surface on which a circuit is formed is in contact with the thermal conductor. 
     
     
         33 . A semiconductor device comprising:
 a semiconductor element;   a lead frame on which the semiconductor element is mounted;   a thermal conductor; and   a sealing resin provided to spacing between the lead frame and the thermal conductor so as to seal the semiconductor element,   the thermal conductor is bonded to the surface of the sealing resin so as to cover the sealing resin.   
     
     
         34 . The semiconductor device according to  claim 33 , wherein the thermal conductor covers the entire surface of the sealing resin. 
     
     
         35 . The semiconductor device according to  claim 33 , wherein the sealing resin is exposed from a surface composed of the side face of the lead frame and the side face of the thermal conductor. 
     
     
         36 . The semiconductor device according to  claim 35 , wherein the sealing resin is exposed from two side-faces opposed to each other. 
     
     
         37 . The semiconductor device according to  claim 35 , wherein the sealing resin is exposed from all of the side faces. 
     
     
         38 . The semiconductor device according to  claim 33 , wherein the thermal conductor is adhered to the lead frame through an insulating adhesive member.