US2011005644A1PendingUtilityA1

Copper alloy material for electric/electronic parts

42
Assignee: MATSUO RYOSUKEPriority: Mar 21, 2008Filed: Sep 20, 2010Published: Jan 13, 2011
Est. expiryMar 21, 2028(~1.7 yrs left)· nominal 20-yr term from priority
H01B 1/026C22C 9/06C22F 1/08
42
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A copper alloy material for an electric/electronic part, containing Co 0.5 to 2.5 mass % and Si 0.1 to 1.0 mass %, at a ratio of Co/Si of 3 to 5 in terms of mass ratio, with the balance of Cu and inevitable impurities, which is obtained by subjecting to a solution treatment at a temperature (° C.) from 800° C. to 960° C. and lower than −122.77X 2 +409.99X+615.74, in which X represents the Co content in mass %.

Claims

exact text as granted — not AI-modified
1 . A copper alloy material for an electric/electronic part, comprising Co 0.5 to 2.5 mass % and Si 0.1 to 1.0 mass %, at a ratio of Co/Si of 3 to 5 in terms of mass ratio, with the balance of Cu and inevitable impurities, which is obtained by subjecting to a solution treatment at a temperature Ts ° C. from 800° C. to 960° C. and lower than −122.77X 2 +409.99X+615.74, in which X represents the Co content in mass %. 
     
     
         2 . The copper alloy material for an electric/electronic part according to  claim 1 , which has a yield stress of not less than 500 MPa but less than 650 MPa, an electrical conductivity of 60% IACS or more, and a value R/t representing a bending property of less than 0.5. 
     
     
         3 . The copper alloy material for an electric/electronic part according to  claim 1 , which has a yield stress of 650 MPa or more, an electrical conductivity of 50% IACS or more, and a value R/t representing a bending property of less than 1.5. 
     
     
         4 . The copper alloy material for an electric/electronic part according to  claim 1 , which has a yield stress of not less than 500 MPa but less than 650 MPa, an electrical conductivity of 60% IACS or more, and a value R/t representing a bending property of 1.2 or less, with respect to each of a sample parallel to a rolling direction and a sample perpendicular to the rolling direction. 
     
     
         5 . The copper alloy material for an electric/electronic part according to  claim 1 , which has a yield stress of 650 MPa or more, an electrical conductivity of 50% IACS or more, and a value R/t representing a bending property of 1.5 or less, with respect to each of a sample parallel to a rolling direction, and a sample perpendicular to the rolling direction. 
     
     
         6 . A copper alloy material for an electric/electronic part, comprising Co 0.5 to 2.5 mass % and Si 0.1 to 1.0 mass %, at a ratio of Co/Si of 3 to 5 in terms of mass ratio, and comprising 0.01 to 1.0 mass % of one or two or more selected from the group consisting of Cr, Mg, Mn, Sn, V, Al, Fe, Ni, Ti and Zr, with the balance of Cu and inevitable impurities, which is obtained by subjecting to a solution treatment at a temperature Ts ° C. from 800° C. to 960° C. and lower than −94.643X 2 +329.99X+677.09, in which X represents the Co content in mass %. 
     
     
         7 . The copper alloy material for an electric/electronic part according to  claim 6 , which has a yield stress of not less than 500 MPa but less than 650 MPa, an electrical conductivity of 60% IACS or more, and a value R/t representing a bending property of less than 0.5. 
     
     
         8 . The copper alloy material for an electric/electronic part according to  claim 6 , which has a yield stress of 650 MPa or more, an electrical conductivity of 50% IACS or more, and a value R/t representing a bending property of less than 1.5. 
     
     
         9 . The copper alloy material for an electric/electronic part according to  claim 6 , which has a yield stress of not less than 500 MPa but less than 650 MPa, an electrical conductivity of 60% IACS or more, and a value R/t representing a bending property of 1.2 or less, with respect to each of a sample parallel to a rolling direction and a sample perpendicular to the rolling direction. 
     
     
         10 . The copper alloy material for an electric/electronic part according to  claim 6 , which has a yield stress of 650 MPa or more, an electrical conductivity of 50% IACS or more, and a value R/t representing a bending property of 1.5 or less, with respect to each of a sample parallel to a rolling direction, and a sample perpendicular to the rolling direction.

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.