US2011011564A1PendingUtilityA1
heat transfer device
Est. expiryJul 6, 2027(~1 yrs left)· nominal 20-yr term from priority
H10W 40/40H10W 40/00
33
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Claims
Abstract
A heat transfer device for maintaining a temperature of a device under test with heat generating capability at a prescribed temperature, the heat transfer device comprising an inlet flow-duct; an outlet flow-duct; a conductor block comprising a plurality of through-holes, the through-holes receiving a fluid from the inlet flow-duct and delivering the fluid to the outlet flow-duct; and inserts disposed in the respective through-holes for reducing a cross-sectional area of the respective through-holes to improve heat transfer efficiency.
Claims
exact text as granted — not AI-modified1 . A heat transfer device for maintaining a temperature of a device under test with heat generating capability at a prescribed temperature, the heat transfer device comprising:
an inlet flow-duct; an outlet flow-duct; a conductor block comprising a plurality of through-holes, the through-holes receiving a fluid from the inlet flow-duct and delivering the fluid to the outlet flow-duct; and inserts disposed in the respective through-holes for reducing a cross-sectional area of the respective through-holes to improve heat transfer efficiency, wherein the inserts disposed in the respective through-holes are arranged such that each insert is not restricted to a fixed position with respect to a center of the cross-sectional area of the respective through-holes.
2 . The heat transfer device as claimed in claim 1 , wherein the inserts are substantially longitudinal and are disposed in the respective through-holes such that longitudinal axes of the respective inserts are substantially parallel to the through-holes.
3 . The heat transfer device as claimed in claim 1 , wherein the inlet and outlet flow-ducts are secured to opposite ends of the conductor block to form a heat transfer (HT) module, wherein heat transfer mainly occurs in the HT module.
4 . The heat transfer device as claimed in claim 1 , wherein the HT module is disposed inside a housing, and the heat transfer device further comprises a valve disposed on the housing for removing air inside the housing and creating a partial vacuum environment around the HT module, wherein the partial vacuum environment facilitates suspension of the HT module in the housing, and provides heat transfer insulation between the HT module and the housing for preventing condensation on the housing.
5 . The heat transfer device as claimed in claim 1 , wherein the conductor block is substantially T-shaped and comprises a stem portion and a branch portion, the branch portion comprising the plurality of through-holes and the stem portion comprising a surface contacting the device under test.
6 . The heat transfer device as claimed in claim 5 , wherein the inlet flow-duct and the outlet flow-duct are secured to opposite ends of the branch portion of the conductor block for facilitating fluid flow through the through-holes.
7 . The heat transfer device as claimed in claim 5 , further comprising a heater layer disposed on a surface of the branch portion of the conductor block opposite the surface of the stem portion of the conductor block contacting the device under test.
8 . The heat transfer device as claimed in claim 7 , wherein the heater layer is secured to the conductor block with a heater fixture, wherein a vacuum seal is disposed between the conductor block and the heater fixture.
9 . The heat transfer device as claimed in claim 1 , further comprising a temperature sensor disposed in the conductor block for measuring the temperature of the device under test.
10 . The heat transfer device as claimed in claim 9 , further comprising a controller coupled to the temperature sensor for maintaining the temperature of the device under test at the prescribed temperature.
11 . The heat transfer device as claimed in claim 10 , wherein the controller maintains the temperature of the device under test at the prescribed temperature by controlling power supply to the heater layer and/or by controlling the fluid flow.
12 . The heat transfer device as claimed in claim 1 , wherein, in operation, fluid enters the through-holes in a substantially saturated liquid state, transitions into a substantially gaseous state under conversion of heat from the device under test, and exits the through-holes in the substantially gaseous state.
13 . The heat transfer device as claimed in claim 4 , wherein the housing is made of high strength materials for providing structural rigidity and withstanding high pressure spikes inside the housing.
14 . The heat transfer device as claimed in claim 4 , wherein the housing is made of materials with high thermal conductivity for preventing localized condensation on the housing.
15 . The heat transfer device as claimed in claim 1 , wherein the through-holes are aligned in a plurality of rows and columns in the conductor block.
16 . The heat transfer device as claimed in claim 1 , comprising one or more insert elements, each insert element threading through one or more of the through-holes.
17 . The heat transfer device as claimed in claim 1 , wherein the inserts are made of materials with high thermal conductivity for enhancing effective heat transfer.
18 . The heat transfer device as claimed in claim 1 , wherein the conductor block is of a single integral component made of a material with high thermal conductivity for providing effective heat transfer.
19 . A heat transfer device for maintaining a temperature of a device under test with heat generating capability at a prescribed temperature, the heat transfer device comprising:
an inlet flow-duct; an outlet flow-duct; a conductor block comprising a plurality of through-holes, the through-holes receiving a fluid from the inlet flow-duct and delivering the fluid to the outlet flow-duct; and wherein the conductor block, inlet and outlet flow-ducts form a HT module and the HT module is disposed inside a housing, and the heat transfer device further comprises a valve disposed on the housing for removing air inside the housing and creating a partial vacuum environment around the HT module, wherein the partial vacuum environment facilitates suspension of the conductor block in the housing, provides heat transfer insulation between the HT module and the housing for preventing condensation on the housing.
20 . The heat transfer device as claimed in claim 13 , wherein the housing is made of materials with high thermal conductivity for preventing localized condensation on the housing.Join the waitlist — get patent alerts
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