Semiconductor device

Abstract

There is provided a semiconductor device adopting, as a layout of pads connected to an external package on an LSI, a zigzag pad layout in which the pads are arranged shifted alternately, which can avoid occurrences of short-circuiting of wires, an increase in chip size due to avoidance of short-circuiting, propagation of power supply or GND noise due to reduction in IO cell interval, and signal transmission delay difference due to displacement of pad positions. In a semiconductor device wherein plural pads on a semiconductor element which are connected to function terminals on an external package are arranged in two lines along the periphery of the semiconductor element, an arrangement order of the plural pads on the semiconductor element is different from an arrangement order of the function terminals on the external package.

1 - 12 . (canceled) 
     
     
         13 . A semiconductor device comprising
 a semiconductor element and a package connecting the semiconductor element, wherein the semiconductor element has   at least two input-output (IO) circuits arranged in a first line, and   at least two pads formed on IO cell corresponding respectively to said at least two IO circuits,   said respective pads are connected to lead frames of the corresponding package by wires, and   an arrangement order of said at least two IO circuits in the first line differs from an arrangement order of the lead frames connected with the pads corresponding to said at least two IO circuits respectively.   
     
     
         14 . A semiconductor device as defined in  claim 13  wherein the pads are formed at least in two lines in a second line being a vertical direction to the first line. 
     
     
         15 . A semiconductor device as defined in  claim 14  wherein said at least two-line pads are formed in a zigzag manner. 
     
     
         16 . A semiconductor device as defined in  claim 13  wherein the lead frames having a different arrangement order are connected with said at least two pads. 
     
     
         17 . A semiconductor device as defined in  claim 16  wherein a power supply voltage is supplied to the lead frame connected with one of said at least two pads. 
     
     
         18 . A semiconductor device as defined in  claim 16  wherein GND is supplied to the lead frame connected with one of said at least two pads.