US2011012670A1PendingUtilityA1

Providing in package power supplies for integrated circuits

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Individually held — no corporate assignee on recordPriority: Apr 1, 2002Filed: Sep 23, 2010Published: Jan 20, 2011
Est. expiryApr 1, 2022(expired)· nominal 20-yr term from priority
Inventors:Steven EskildsenDuane R. Mills
H10W 90/754H10W 90/734H10W 74/00H10W 72/5366H10W 72/884H10W 72/552H10W 72/00G11C 5/147G11C 16/30Y10T29/49144Y10T29/4913Y10T29/49169Y10T29/49126
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Claims

Abstract

A device with an in package power supply may be utilized to supply power to other components. As a result, the overall system size may be reduced and economies may be achieved.

Claims

exact text as granted — not AI-modified
1 . A method comprising:
 supplying power to an integrated circuit using a power supply in a package with the integrated circuit; and   selectively supplying power to a component from the power supply external to the package when the integrated circuit is not in operation, using a lower supply voltage than said integrated circuit.   
     
     
         2 . The method of  claim 1  wherein supplying power to an integrated circuit comprises supplying power to a memory. 
     
     
         3 . The method of  claim 1  wherein supplying power to a component comprises supplying power to a memory. 
     
     
         4 . The method of  claim 1  wherein supplying power to a component comprises supplying power to a component on a board on which the integrated circuit and the power supply are mounted. 
     
     
         5 . The method of  claim 1  wherein the package is a first package and wherein supplying power to a component comprises supplying power to an integrated circuit in a second package separate from the first package.

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