US2011013360A1PendingUtilityA1

Quasi-radial heatsink with rectangular form factor and uniform fin length

43
Individually held — no corporate assignee on recordPriority: Feb 14, 2006Filed: Jan 8, 2010Published: Jan 20, 2011
Est. expiryFeb 14, 2026(expired)· nominal 20-yr term from priority
Inventors:Mark GallinaKevin Ceurter
H10W 40/43H10W 40/22Y10T29/4935
43
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Claims

Abstract

In some embodiments, a heatsink includes a thermally conductive core and at least ten thermally conductive fins extending quasi-radially from the thermally conductive core, wherein most of the fins are of uniform length, and wherein at least a portion of the thermally conductive core is shaped such that the fins having uniform length form a substantially rectangular cross sectional form factor. Other embodiments are disclosed and claimed.

Claims

exact text as granted — not AI-modified
1 . An apparatus, comprising:
 a thermally conductive core; and   at least ten thermally conductive fins extending quasi-radially from the thermally conductive core, wherein most of the fins are of uniform length,   and wherein at least a portion of the thermally conductive core is shaped such that the fins having uniform length form a substantially rectangular form factor.   
     
     
         2 . The apparatus of  claim 1 , wherein the fins having uniform length also have uniform thickness profiles. 
     
     
         3 . The apparatus of  claim 2 , wherein the fins having uniform length and thickness profiles also have uniform tip-to-tip spacing. 
     
     
         4 . The apparatus of  claim 2 , wherein the fins having uniform length and thickness profiles also have uniform cross-sectional area between the fins. 
     
     
         5 . The apparatus of  claim 4 , wherein the all of the fins are configured to be suitable for manufacturing by an extrusion process. 
     
     
         6 . The apparatus of  claim 5 , wherein the thermally conductive core and the fins are aluminum. 
     
     
         7 . The apparatus of  claim 1 , wherein the thermally conductive core includes a copper portion. 
     
     
         8 . The apparatus of  claim 1 , further comprising:
 two fins on opposite sides of the thermally conductive core which are longer than the other fins and are adapted to be utilized as structural members to transfer a preload to a heat source.   
     
     
         9 . The apparatus of  claim 8 , wherein the two longer fins are also thicker than the other fins. 
     
     
         10 . A method, comprising:
 forming a thermally conductive core; and   forming at least ten thermally conductive fins extending quasi-radially from the thermally conductive core, wherein most of the fins are of uniform length,   and wherein at least a portion of the thermally conductive core is shaped such that the fins having uniform length form a substantially rectangular form factor.   
     
     
         11 . The method of  claim 10 , wherein the fins having uniform length also have uniform thickness profiles. 
     
     
         12 . The method of  claim 11 , wherein the fins having uniform length and thickness profiles also have uniform tip-to-tip spacing. 
     
     
         13 . The method of  claim 11 , wherein the fins having uniform length and thickness profiles also have uniform cross-sectional area between the fins. 
     
     
         14 . The method of  claim 13 , further comprising:
 forming all of the fins to be suitable for manufacturing by an extrusion process.   
     
     
         15 . The method of  claim 14 , further comprising:
 extruding the thermally conductive core and fins from aluminum.   
     
     
         16 . The method of  claim 10 , further comprising:
 forming the thermally conductive core to include a copper portion.   
     
     
         17 . The method of  claim 10 , further comprising:
 forming two fins on opposite sides of the thermally conductive core which are longer than the other fins and are adapted to be utilized as structural members to transfer a preload to a heat source.   
     
     
         18 . The method of  claim 17 , wherein the two longer fins are also thicker than the other fins. 
     
     
         19 . A system, comprising:
 a system board;   an electronic component on the system board; and   a heatsink thermally coupled to the electronic component, the heatsink comprising:
 a thermally conductive core; and 
 at least ten thermally conductive fins extending quasi-radially from the thermally conductive core, wherein most of the fins are of uniform length, 
 and wherein at least a portion of the thermally conductive core is shaped such that the fins having uniform length form a substantially rectangular form factor. 
   
     
     
         20 . The system of  claim 19 , wherein the fins having uniform length also have uniform thickness profiles. 
     
     
         21 . The system of  claim 20 , wherein the fins having uniform length and thickness profiles also have uniform tip-to-tip spacing. 
     
     
         22 . The system of  claim 20 , wherein the fins having uniform length and thickness profiles also have uniform cross-sectional area between the fins. 
     
     
         23 . The system of  claim 22 , wherein all of the fins are configured to be suitable for manufacturing by an extrusion process. 
     
     
         24 . The system of  claim 23 , wherein the thermally conductive core and the fins are aluminum. 
     
     
         25 . The system of  claim 19 , wherein the thermally conductive core includes a copper portion. 
     
     
         26 . The system of  claim 19 , further comprising:
 two fins on opposite sides of the thermally conductive core which are longer than the other fins and are adapted to be utilized as structural members to transfer a preload to the electronic component.   
     
     
         27 . The system of  claim 26 , wherein the two longer fins are also thicker than the other fins. 
     
     
         28 . The system of  claim 19 , wherein the electronic component comprises a processor. 
     
     
         29 . The system of  claim 28 , further comprising:
 a double data rate memory coupled to the system board.   
     
     
         30 . The system of  claim 19 , further comprising:
 a rectangular form factor duct positioned around the heatsink; and   a fan positioned to provide cooling air through the duct.

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