Grooved cmp polishing pad

Abstract

The present invention provides polishing pads for use in CMP processes. In one embodiment, a pad comprises a surface defining a plurality of grooves with landing surfaces separating the grooves, the landing surfaces together defining a substantially coplanar polishing surface, each groove having a depth of at least about 10 mil and a width, W G , with any two adjacent grooves being separated from each other a landing surface having a width, W L , wherein the quotient W L /W G is less than or equal to 3. In a preferred embodiment, the surface of the pad defines a series of concentric substantially circular grooves. In an alternative embodiment, the surface of the pad defines a spiral groove having a depth of at least about 10 mil and a width W G , and a spiral landing surface outlining spiral groove the having a width, W L , wherein the spiral landing surface defines a substantially coplanar polishing surface and the quotient W L /W G is less than or equal to 3.

1 . A polishing pad suitable for use in chemical-mechanical polishing of a substrate, the pad comprising a surface defining a plurality of grooves with landing surfaces separating the grooves, the landing surfaces together defining a substantially coplanar polishing surface, each groove having a depth of at least about 10 mil and a width, W G , with any two adjacent grooves being separated by a landing surface having a width, W L , wherein the quotient W L /W G , is less than or equal to 3. 
     
     
         2 . The polishing pad of  claim 1  wherein the plurality of grooves comprises concentric, substantially circular grooves. 
     
     
         3 . The polishing pad of  claim 1  wherein the grooves have a depth of not more than about 50 mil. 
     
     
         4 . The polishing pad of  claim 1  wherein the depth of each groove is in the range of about 10 to about 50 mil. 
     
     
         5 . The polishing pad of  claim 1  wherein W L  for each landing surface is not more than about 80 mil. 
     
     
         6 . The polishing pad of  claim 1  wherein W L  for each landing surface is in the range of about 30 mil to about 60 mil. 
     
     
         7 . The polishing pad of  claim 1  wherein W G  for each groove is in the range of about 20 mil to about 40 mil. 
     
     
         8 . The polishing pad of  claim 1  wherein each groove has substantially the same depth. 
     
     
         9 . The polishing pad of  claim 1  wherein each groove has substantially the same W G . 
     
     
         10 . The polishing pad of  claim 1  wherein each landing surface has substantially the same W L . 
     
     
         11 . A polishing pad suitable for use in chemical-mechanical polishing of a substrate, the pad comprising a surface defining a spiral groove with a spiral landing surface separating the turns of the spiral groove, the spiral landing surface defining a substantially coplanar polishing surface, the groove having a depth of at least about 10 mil and a width, W G , and the landing surface having a width, W L , wherein the quotient W L /W G  is less than or equal to 3. 
     
     
         12 . The polishing pad of  claim 11  wherein the spiral groove has a depth of not more than about 50 mil. 
     
     
         13 . The polishing pad of  claim 11  wherein the depth of the groove is in the range of about 10 to about 50 mil. 
     
     
         14 . The polishing pad of  claim 11  wherein W L  is not more than about 80 mil. 
     
     
         15 . The polishing pad of  claim 11  wherein W L  is in the range of about 30 mil to about 60 mil. 
     
     
         16 . The polishing pad of  claim 11  wherein W G  is in the range of about 20 mil to about 40 mil. 
     
     
         17 . The polishing pad of  claim 11  wherein the quotient W L /W G  is less than or equal to about 2. 
     
     
         18 . The polishing pad of  claim 11  wherein the quotient W L /W G  is less than or equal to about 1. 
     
     
         19 . The polishing pad of  claim 1  wherein the quotient W L /W G  is less than or equal to about 2. 
     
     
         20 . The polishing pad of  claim 1  wherein the quotient W L /W G  is less than or equal to about 1.