US2011017358A1PendingUtilityA1

Copper alloy material for electrical/electronic equipments, and electrical/electronic part

Assignee: SATO KOJIPriority: Mar 31, 2008Filed: Sep 29, 2010Published: Jan 27, 2011
Est. expiryMar 31, 2028(~1.7 yrs left)· nominal 20-yr term from priority
H10W 70/456C22C 9/06H01R 13/03C22C 9/10C22F 1/08
36
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Claims

Abstract

A copper alloy material for an electrical/electronic equipment, containing Ni not less than 2.0 mass % and less than 3.3 mass %, having a content of Si within the range of 2.8 to 3.8 in terms of a mass ratio of Ni and Si (Ni/Si), and containing Mg 0.01 to 0.2 mass %, Sn 0.05 to 1.5 mass %, and Zn 0.2 to 1.5 mass %, with the balance of Cu and inevitable impurities, wherein when a test piece with thickness t of 0.20 mm and width w of 2.0 mm is subjected to 180°-bending with bending radius R (mm), a value of the minimum bending radius R causing no cracks is 0 mm to 0.1 mm; and, an electrical/electronic part obtained by working the same.

Claims

exact text as granted — not AI-modified
1 . A copper alloy material for an electrical/electronic equipment, containing Ni not less than 2.0 mass % and less than 3.3 mass %, having a content of Si within the range of 2.8 to 3.8 in terms of a mass ratio of Ni and Si (Ni/Si), and containing Mg 0.01 to 0.2 mass %, Sn 0.05 to 1.5 mass %, and Zn 0.2 to 1.5 mass %, with the balance of Cu and inevitable impurities, wherein when a test piece with thickness t of 0.20 mm and width w of 2.0 mm is subjected to 180°-bending with bending radius R (mm), a value of the minimum bending radius R causing no cracks is 0 mm to 0.1 mm. 
     
     
         2 . The copper alloy material for an electrical/electronic equipment according to  claim 1 , which is produced by subjecting a cast ingot to a hot rolling, a dough (cold) rolling, and a solution treatment, followed by an intermediate (cold) rolling with rolling ratio of 5 to 50%, an aging at 400 to 600° C. for 0.5 to 12 hours, a finish (cold) rolling with rolling ratio of 30% or less, and a low-temperature annealing, in this order. 
     
     
         3 . The copper alloy material for an electrical/electronic equipment according to  claim 1 , which is produced by subjecting a cast ingot to a hot rolling, a dough (cold) rolling, and a solution treatment, followed by an aging at 300 to 400° C. for 0.5 to 8 hours, a further aging at 425 to 600° C. for 0.5 to 12 hours, a finish (cold) rolling, and a low-temperature annealing, in this order. 
     
     
         4 . The copper alloy material for an electrical/electronic equipment according to  claim 1 , which is produced by subjecting a cast ingot to a hot rolling, a dough (cold) rolling, and a solution treatment, followed by an intermediate (cold) rolling with rolling ratio of 5 to 50%, an aging at 300 to 400° C. for 0.5 to 8 hours, a further aging at 425 to 600° C. for 0.5 to 12 hours, a finish (cold) rolling with rolling ratio of 30% or less, and a low-temperature annealing, in this order. 
     
     
         5 . A copper alloy material for an electrical/electronic equipment, containing Ni not less than 2.0 mass % and less than 3.3 mass %, having a content of Si within the range of 2.8 to 3.8 in terms of a mass ratio of Ni and Si (Ni/Si), and containing Mg 0.01 to 0.2 mass %, Sn 0.05 to 1.5 mass %, Zn 0.2 to 1.5 mass %, and one or more selected from the group consisting of Ag, Co, and Cr in a sum total of 0.005 to 2.0 mass %, with the balance of Cu and inevitable impurities, wherein when a test piece with thickness t of 0.20 mm and width w of 2.0 mm is subjected to 180°-bending with bending radius R (mm), a value of the minimum bending radius R causing no cracks is 0 mm to 0.1 mm. 
     
     
         6 . The copper alloy material for an electrical/electronic equipment according to  claim 5 , which is produced by subjecting a cast ingot to a hot rolling, a dough (cold) rolling, and a solution treatment, followed by an intermediate (cold) rolling with rolling ratio of 5 to 50%, an aging at 400 to 600° C. for 0.5 to 12 hours, a finish (cold) rolling with rolling ratio of 30% or less, and a low-temperature annealing, in this order. 
     
     
         7 . The copper alloy material for an electrical/electronic equipment according to  claim 5 , which is produced by subjecting a cast ingot to a hot rolling, a dough (cold) rolling, and a solution treatment, followed by an aging at 300 to 400° C. for 0.5 to 8 hours, a further aging at 425 to 600° C. for 0.5 to 12 hours, a finish (cold) rolling, and a low-temperature annealing, in this order. 
     
     
         8 . The copper alloy material for an electrical/electronic equipment according to  claim 5 , which is produced by subjecting a cast ingot to a hot rolling, a dough (cold) rolling, and a solution treatment, followed by an intermediate (cold) rolling with rolling ratio of 5 to 50%, an aging at 300 to 400° C. for 0.5 to 8 hours, a further aging at 425 to 600° C. for 0.5 to 12 hours, a finish (cold) rolling with rolling ratio of 30% or less, and a low-temperature annealing, in this order. 
     
     
         9 . An electrical/electronic part obtained by working a copper alloy material for an electrical/electronic equipment, with the copper alloy material containing Ni not less than 2.0 mass % and less than 3.3 mass %, having a content of Si within the range of 2.8 to 3.8 in terms of a mass ratio of Ni and Si (Ni/Si), and containing Mg 0.01 to 0.2 mass %, Sn 0.05 to 1.5 mass %, and Zn 0.2 to 1.5 mass %, with the balance of Cu and inevitable impurities, wherein when a test piece of the copper alloy material with thickness t of 0.20 mm and width w of 2.0 mm is subjected to 180°-bending with bending radius R (mm), a value of the minimum bending radius R causing no cracks is 0 mm to 0.1 mm. 
     
     
         10 . An electrical/electronic part obtained by working a copper alloy material for an electrical/electronic equipment, with the copper alloy material containing Ni not less than 2.0 mass % and less than 3.3 mass %, having a content of Si within the range of 2.8 to 3.8 in terms of a mass ratio of Ni and Si (Ni/Si), and containing Mg 0.01 to 0.2 mass %, Sn 0.05 to 1.5 mass %, Zn 0.2 to 1.5 mass %, and one or more selected from the group consisting of Ag, Co, and Cr in a sum total of 0.005 to 2.0 mass %, with the balance of Cu and inevitable impurities, wherein when a test piece of the copper alloy material with thickness t of 0.20 mm and width w of 2.0 mm is subjected to 180°-bending with bending radius R (mm), a value of the minimum bending radius R causing no cracks is 0 mm to 0.1 mm.

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