Method of reproducing a molding die for molding glass

Abstract

A method of reproducing the molding die for molding glass, the molding die for molding glass comprising a base material, a first intermediate layer, which is made of titanium or other materials that is not easy to be attacked, on the base material, a protective film, which is made of molybdenum alloy, on the first intermediate layer; the method comprising the steps of attacking the protective film to remove the protective film but keep the first intermediate layer and the base material still, and then coating a new protective layer on the first intermediate layer.

1 . A method of reproducing a molding die for molding glass, the molding die for molding glass comprising a base material, a first intermediate layer, which is made of titanium or other materials that is not easy to be attacked, on the base material, a protective film, which is made of molybdenum alloy, on the first intermediate layer; the method comprising the steps of attacking the protective film to remove the protective film but keep the first intermediate layer and the base material still, and then coating a new protective layer on the first intermediate layer. 
     
     
         2 . The method as defined in  claim 1 , wherein an attacking solution is utilized in removing the protective film. 
     
     
         3 . The method as defined in  claim 2 , wherein the attacking solution includes (NH 4 ) 2 Ce(NO 3 ) 6 . 
     
     
         4 . The method as defined in  claim 2 , wherein the attacking solution is acetic acid or nitric acid. 
     
     
         5 . A method of reproducing the molding die for molding glass, the molding die for molding glass comprising a base material, a first intermediate layer, which is made of titanium or other materials that is not easy to be attacked, on the base material, a protective film, which is made of molybdenum alloy, on the first intermediate layer, a second intermediate layer, which is made of chromium or other material that is easy to be attacked, between first intermediate layer and the protective layer; the method comprising the steps of attacking the protective film and the second intermediate layer to remove the protective film and the second intermediate layer but keep the first intermediate layer and the base material still, and then coating a new second intermediate layer on the first intermediate layer and a new protective layer on the second intermediate layer. 
     
     
         6 . The method as defined in  claim 5 , wherein an attacking solution is utilized in removing the protective film. 
     
     
         7 . The method as defined in  claim 6 , wherein the attacking solution includes (NH 4 ) 2 Ce(NO 3 ) 6 . 
     
     
         8 . The method as defined in  claim 6 , wherein the attacking solution is acetic acid or nitric acid.