Flexible circuit module

Abstract

This disclosure pertains to a flexible circuit module and related methods of manufacturing and applications for such a flexible circuit module. In one exemplary embodiment, the flexible circuit module comprises a flexible substrate, at least one flexible chip element, and a flexible top layer disposed over the flexible substrate and the flexible chip element. According to an aspect, a flexible circuit module is used in flexible electronic devices. According to another aspect, a flexible circuit module is attached to the inner surface of an electronic device and connected to the device main board. According to another aspect, a flexible circuit module is used in the place of a current PCB in a PCBA. According to another aspect, a flexible circuit module is rolled up and used inside an electronic device. According to another aspect, a flexible circuit module is molded.

1 . A flexible circuit module, the module comprising:
 a flexible substrate;   at least one flexible chip disposed on a top surface of the flexible substrate; and   a flexible top layer laminated to the top surface of the flexible substrate, wherein the at least one flexible chip is disposed in between the flexible substrate and the flexible top layer; and   wherein the flexible top layer forms a conformal layer on the entire top surface of the flexible substrate.   
     
     
         2 . The module of  claim 1 , wherein the flexible top layer is chemically bonded to the top surface of the flexible substrate. 
     
     
         3 . The module of  claim 1 , wherein the at least one flexible chip is partially embedded in the flexible substrate. 
     
     
         4 . The module of  claim 1 , wherein the at least one flexible chip comprises a memory chip. 
     
     
         5 . The module of  claim 1 , further comprising at least one passive chip. 
     
     
         6 . The module of  claim 1 , further comprising at least one memory controller. 
     
     
         7 . The module of  claim 1 , further comprising at least one surface mount component. 
     
     
         8 . The module of  claim 1 , wherein the flexible substrate comprises at least one connecting pad. 
     
     
         9 . The module of  claim 1 , wherein the flexible top layer is transparent. 
     
     
         10 . The module of  claim 1 , wherein the flexible top layer is made of a polymer material. 
     
     
         11 . The module of  claim 1 , wherein the flexible top layer cooperates with the flexible substrate to provide a hermetic seal for the at least one flexible chip. 
     
     
         12 . The module of  claim 1 , wherein the at least one flexible chip has a thickness that is less than 25 micrometers thick. 
     
     
         13 . The module of  claim 1 , wherein at least one input/output interface of the at least one flexible chip is connected to at least one connecting pad of the flexible substrate. 
     
     
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         25 . A flexible circuit module, the module comprising:
 a flexible substrate;   at least one flexible chip disposed on a top surface of the flexible substrate; and   a flexible top layer laminated to a portion of the top surface of the flexible substrate, wherein the at least one flexible chip is disposed in between the flexible substrate and the flexible top layer; and   wherein the flexible top layer forms a conformal layer on the at least one flexible chip, and wherein the flexible top layer cooperates with the flexible substrate to provide a hermetic seal for the at least one flexible chip, thereby sealing the at least one flexible chip from the environment.   
     
     
         26 . The module of  claim 25 , wherein the flexible top layer is chemically bonded to the top surface of the flexible substrate. 
     
     
         27 . The module of  claim 25 , wherein the at least one flexible chip comprises a memory chip. 
     
     
         28 . The module of  claim 25 , further comprising at least one passive chip. 
     
     
         29 . The module of  claim 25 , further comprising at least one memory controller. 
     
     
         30 . The module of  claim 25 , further comprising at least one surface mount component. 
     
     
         31 . The module of  claim 25 , wherein the flexible substrate comprises at least one connecting pad. 
     
     
         32 . The module of  claim 25 , wherein the flexible top layer is transparent. 
     
     
         33 . The module of  claim 25 , wherein the flexible top layer is made of a polymer material. 
     
     
         34 . The module of  claim 25 , wherein the at least one flexible chip has a thickness that is less than 25 micrometers thick. 
     
     
         35 . The module of  claim 25 , wherein at least one input/output interface of the at least one flexible chip is connected to at least one connecting pad of the flexible substrate.