Multi-layer microwave corrugated printed circuit board and method

Abstract

A multi-layer microwave corrugated printed circuit board is provided. In one embodiment, the invention relates to a method for interconnecting components of a corrugated printed circuit board, the components including a first flexible layer having a first signal line on a surface of the first flexible layer and a second flexible layer having a second signal line on a surface of the second flexible layer, the method including forming at least one first hole in the first flexible layer, forming a conductive pad on the second flexible layer, forming at least one second hole in a non-conductive adhesive layer, aligning the at least one second hole with the at least one first hole and the conductive pad, bonding the first flexible layer and the second flexible layer, with the non-conductive adhesive layer disposed there between, and filling the at least one first hole and the at least one second hole with a conductive paste to electrically couple the first signal line with the second signal line.

1 . A method for interconnecting components of a corrugated printed circuit board, the components comprising a first flexible layer having a first signal line on a surface of the first flexible layer and a second flexible layer having a second signal line on a surface of the second flexible layer, the method comprising:
 forming at least one first hole in the first flexible layer;   forming a conductive pad on the second flexible layer;   forming at least one second hole in a non-conductive adhesive layer;   aligning the at least one second hole with the at least one first hole and the conductive pad;   bonding the first flexible layer and the second flexible layer, with the non-conductive adhesive layer disposed there between; and   filling the at least one first hole and the at least one second hole with a conductive paste to electrically couple the first signal line with the second signal line.   
     
     
         2 . The method of  claim 1 , wherein the first flexible layer is a folded flexible layer, and the second flexible layer is a flat flexible layer. 
     
     
         3 . The method of  claim 1 , wherein the first flexible layer is a flat flexible layer, and the second flexible layer is a folded flexible layer. 
     
     
         4 . The method of  claim 1 :
 wherein the at least one first hole comprises:
 a first through hole for the first signal line; 
 a second through hole for a first ground plane line; and 
 a third through hole for a second ground plane line; 
   wherein the at least one second hole comprises:
 a fourth through hole for the second signal line; 
 a fifth through hole for a third ground plane line; and 
 a sixth through hole for a fourth ground plane line; 
   wherein the filling the at least one first hole and the at least one second hole with the conductive paste comprises filling the first through hole, the second through hole, the third through hole, the fourth through hole, the fifth through hole, and the sixth through hole with the conductive paste.   
     
     
         5 . The method of  claim 1 , wherein the conductive paste electrically couples a ground plane of the first flexible layer with a ground plane of the second flexible layer. 
     
     
         6 . The method of  claim 1 , wherein the conductive paste is a conductive adhesive paste. 
     
     
         7 . The method of  claim 1 , further comprising adding a non-conductive paste to the second flexible layer prior to the bonding the first flexible layer and the second flexible layer. 
     
     
         8 . The method of  claim 1 , further comprising adding a non-conductive adhesive layer to the second flexible layer prior to the bonding the first flexible layer and the second flexible layer. 
     
     
         9 . The method of  claim 1 , further comprising curing the conductive paste. 
     
     
         10 . The method of  claim 1 , wherein the components of the corrugated printed circuit board further comprise a third flexible layer and a fourth flexible layer. 
     
     
         11 . The method of  claim 10 , wherein the third flexible layer is a folded flexible layer, and the fourth flexible layer is a flat flexible layer. 
     
     
         12 . The method of  claim 10 :
 wherein the first flexible layer is a flat flexible layer, and the second flexible layer is a folded flexible layer;   wherein the third flexible layer is a flat flexible layer, and the fourth flexible layer is a folded flexible layer;   wherein the third flat flexible layer is coupled between the second folded flexible layer and the fourth folded flexible layer;   wherein a flute of the second folded flexible layer extends in a first direction;   wherein a flute of the fourth folded flexible layer extends in a second direction; and   wherein the first direction and the second direction are not the same.   
     
     
         13 . An interconnect assembly for a corrugated printed circuit board, the interconnect assembly comprising:
 a first flexible layer having a first signal line on a surface of the first flexible layer, the first flexible layer comprising a first hole;   a second flexible layer having a second signal line on a surface of the second flexible layer, the second flexible layer comprising a conductive pad;   a non-conductive adhesive layer having a second hole, the non-conductive adhesive layer disposed between, and coupled with, the first flexible layer and the second flexible layer, wherein the first hole, the second hole, and conductive pad are aligned such that the first hole and second hole comprise a third hole; and   conductive paste disposed within the third hole to electrically couple the first signal line and the second signal line.   
     
     
         14 . The interconnect assembly of  claim 13 , wherein the first flexible layer is a folded flexible layer, and the second flexible layer is a flat flexible layer. 
     
     
         15 . The interconnect assembly of  claim 13 , wherein the first flexible layer is a flat flexible layer, and the second flexible layer is a folded flexible layer. 
     
     
         16 . The interconnect assembly of  claim 13 :
 wherein the first hole comprises a first through hole for the first signal line;   wherein the first flexible layer further comprises:
 a second through hole for coupling a ground plane of the first flexible layer; and 
 a third through hole for coupling the ground plane of the first flexible layer; 
   wherein the second hole comprises a fourth through hole for the second signal line; and   wherein the second flexible layer further comprises:
 a fifth through hole for coupling a ground plane of the second flexible layer; and 
 a sixth through hole for coupling to the ground plane of the second flexible layer. 
   
     
     
         17 . The interconnect assembly of  claim 13 , wherein the conductive paste is a conductive adhesive paste. 
     
     
         18 . The interconnect assembly of  claim 13 , further comprising a non-conductive paste disposed on the second flexible layer. 
     
     
         19 . The interconnect assembly of  claim 13 , further comprising a non-conductive adhesive layer disposed on the second flexible layer. 
     
     
         20 . The interconnect assembly of  claim 13 , further comprising a third flexible layer and a fourth flexible layer. 
     
     
         21 . The interconnect assembly of  claim 20 , wherein the third flexible layer is a folded flexible layer, and the fourth flexible layer is a flat flexible layer. 
     
     
         22 . The interconnect assembly of  claim 20 :
 wherein the first flexible layer is a flat flexible layer, and the second flexible layer is a folded flexible layer;   wherein the third flexible layer is a flat flexible layer, and the fourth flexible layer is a folded flexible layer;   wherein the third flat flexible layer is coupled between the second folded flexible layer and the fourth folded flexible layer;   wherein a flute of the second folded flexible layer extends in a first direction;   wherein a flute of the fourth folded flexible layer extends in a second direction; and   wherein the first direction and the second direction are not the same.