Optical element package, semiconductor light-emitting device, and lighting device

Abstract

To provide a semiconductor light-emitting device which enhances heat dissipation properties, prevents occurrence of solder crack, and is mounted with the improved accuracy, an optical element package 1 includes a base 10 having a mount portion 13 and through-holes 11 and 12 opposite to each other with the mount portion 13 therebetween, leads 21 and 22 led through the through-holes 11 and 12 , and insulating materials 31 and 32 filled in the through-holes 11 and 12 , wherein the leads 21 and 22 are fixed in a state of being insulated from the base 10 by the insulating materials 31 and 32.

1 . An optical element package for packaging an optical element therein, comprising:
 a base made of oxygen-free copper or a copper alloy, and having a mount portion on an upper surface thereof for mounting the optical element thereon and a through-hole;   a lead passing through the through-hole and to be connected to the optical element; and   an insulating material filled in the through-hole and fixing the lead such that the lead is insulated from the base, wherein   the lead extends outwardly from the through-hole at one end, and   a portion of the lead passing out of the through-hole at the one end is bent in a direction toward an outer circumference of the base so as to extend along the bottom surface of the base.   
     
     
         2 . (canceled) 
     
     
         3 . (canceled) 
     
     
         4 . The optical element package of  claim 1 , wherein
 the bottom surface of the base has a protruding portion, and
 a bottom level of the protruding portion is flush with a bottom level of an extending portion of the lead that extends along the bottom surface of the base. 
   
     
     
         5 . The optical element package of  claim 1 , wherein
 a portion of the lead that passes through the through-hole has been offset from a center of the through-hole in the direction toward the outer circumference of the base, and   the lead is bent toward the center of the base at another end in a vicinity of the mount portion.   
     
     
         6 . The optical element package of  claim 1 , wherein
 a central portion of the upper surface of the base is recessed so that an outer circumferential portion of the base is higher than the mount portion.   
     
     
         7 . The optical element package of  claim 6 , wherein
 a surface of the central portion of the base that is recessed is coated with silver or a silver alloy.   
     
     
         8 . The optical element package of  claim 1 , wherein
 the insulating material is made of highly reflective white glass.   
     
     
         9 . The optical element package of  claim 1 , wherein
 the one end of the lead extends beyond the outer circumference of the base, and is bent upwardly at an endmost portion thereof.   
     
     
         10 . The optical element package of  claim 9 , wherein
 a width of the endmost portion of the lead is smaller than a width of an extending portion of the lead that extends along the bottom surface of the base.   
     
     
         11 . The optical element package of  claim 1 , wherein
 the insulating material intervenes between the bottom surface of the base and an extending portion of the lead that extends along the bottom surface of the base.   
     
     
         12 . The optical element package of  claim 1 , wherein
 the insulating material is made of soda-lime glass or borosilicate glass.   
     
     
         13 . The optical element package of  claim 1 , wherein
 the lead is made of an iron-nickel alloy.   
     
     
         14 . The optical element package of  claim 1 , further comprising;
 an auxiliary base portion fixed in a state of being insulated from the base, wherein   an upper surface of the auxiliary base portion has a mount portion for mounting the optical element thereon.   
     
     
         15 . The optical element package of  claim 14 , wherein
 a plurality of auxiliary base portions are provided for a main body of the base, and   an upper surface of each auxiliary base portion has the mount portion.   
     
     
         16 . A semiconductor light-emitting device, wherein
 an optical element is provided in an optical element package as defined in  claim 1 , and is connected to the lead by wire bonding.   
     
     
         17 . A lighting fixture, wherein
 a semiconductor light-emitting device as defined in  claim 16  is mounted on a substrate having a wire connected to a driving circuit.