Seamless mold manufacturing method

Abstract

A seamless mold manufacturing method of the invention is a seamless mold manufacturing method having the steps of forming a thermal reaction type resist layer on a sleeve-shaped mold, and exposing using a laser and developing the thermal reaction type resist layer and thereby forming a fine mold pattern, and is characterized in that the thermal reaction type resist layer is comprised of a thermal reaction type resist having a property of reacting in predetermined light intensity or more in a light intensity distribution in a spot diameter of the laser.

1 - 25 . (canceled) 
     
     
         26 . A seamless mold manufacturing method comprising:
 forming a thermal reaction type resist layer on a sleeve-shaped mold; and   forming a fine mold pattern on the thermal reaction type resist layer using a laser,   wherein the thermal reaction type resist layer is comprised of a thermal reaction type resist material having a property of reacting in predetermined light intensity or more in a light intensity distribution in a spot diameter of the laser.   
     
     
         27 . A seamless mold manufacturing method comprising:
 forming a thermal reaction type resist layer on a sleeve-shaped mold; and   forming a fine mold pattern on the thermal reaction type resist layer using a laser,   wherein the thermal reaction type resist layer is comprised of a thermal reaction type resist material having a temperature distribution including a region where the resist reacts at a predetermined temperature or more in a spot diameter of the laser.   
     
     
         28 . The seamless mold manufacturing method according to  claim 26  or  27 , further comprising:
 forming an etching layer on the sleeve-shaped mold before forming the thermal reaction type resist layer on the sleeve-shaped mold; 
 etching the etching layer using the fine mold pattern as a mask; and removing the fine mold pattern. 
 
     
     
         29 . The seamless mold manufacturing method according to  claim 26 , wherein the thermal reaction type resist is an organic resist or an inorganic resist. 
     
     
         30 . The seamless mold manufacturing method according to  claim 26 , wherein the thermal reaction type resist is comprised of an imperfect oxide of an element selected from the group consisting of transition metals and group-XII to group-XV elements, and a boiling point of a primary fluoride of the element is 200° C. or more. 
     
     
         31 . The seamless mold manufacturing method according to  claim 30 , wherein the transition metals are elements selected from the group consisting of Ti, Cr, Mn, Fe, Co, Ni, Cu, Zr, Nb, Rh, Ag, Hf, Ta and Au. 
     
     
         32 . The seamless mold manufacturing method according to  claim 30  or  31 , wherein the group-XII to group-XV elements are elements selected from the group consisting of Al, Zn, Ga, In, Sn, Sb, Pb and Bi. 
     
     
         33 . The seamless mold manufacturing method according to  claim 30 , wherein the transition metals are elements selected from the group consisting of Ti, Cr, Mn, Co, Cu, Nb, Ag, Ta and Au, and the group-XII to group-XV elements are elements selected from the group consisting of Sn, Pb and Bi. 
     
     
         34 . The seamless mold manufacturing method according to  claim 28 , wherein the etching layer is comprised of a material selected from the group consisting of Si, Ta, and oxides, nitrides and carbides of Si and Ta. 
     
     
         35 . The seamless mold manufacturing method according to  claim 26 , wherein a film thickness of the thermal reaction type resist layer has a fluctuation range of ±20 nm or less in a circumference of the sleeve in the film thickness. 
     
     
         36 . The seamless mold manufacturing method according to  claim 26 , wherein the thermal reaction type resist layer is comprised of at least two layers. 
     
     
         37 . The seamless mold manufacturing method according to  claim 28 , further comprising:
 forming a heat absorption layer above the etching layer.   
     
     
         38 . The seamless mold manufacturing method according to  claim 37 , wherein forming the heat absorption layer on or under the etching layer is before forming the thermal reaction type resist layer on the etching layer. 
     
     
         39 . The seamless mold manufacturing method according to  claim 28 , further comprising:
 forming a heat insulating layer on the sleeve-shaped mold before forming the etching layer on the sleeve-shaped mold.   
     
     
         40 . The seamless mold manufacturing method according to  claim 26 , wherein a method of forming any one of the thermal reaction type resist layer, the etching layer and the heat absorption layer is foamed by a sputtering method, a deposition method or a CVD method. 
     
     
         41 . The seamless mold manufacturing method according to  claim 26 , wherein a beam shape of the laser is an elliptical shape in exposure using the laser. 
     
     
         42 . The seamless mold manufacturing method according to  claim 28 , wherein in etching the etching layer, a dry etching apparatus is used in which a counter electrode is arranged in a position opposed to the sleeve-shaped mold surface in a vacuum chamber. 
     
     
         43 . A dry etching apparatus as described in  claim 42 , wherein a counter electrode is arranged in a position opposed to the sleeve-shaped mold surface in a vacuum chamber. 
     
     
         44 . The dry etching apparatus according to  claim 43 , wherein a shape of the counter electrode is a shape selected from a cylindrical shape, a parallel flat-plate shape, and an arc shape. 
     
     
         45 . The dry etching apparatus according to  claim 43 , wherein the dry etching apparatus has a function of rotating the sleeve-shaped mold on the center axis. 
     
     
         46 . A seamless mold, wherein the mold is manufactured by the seamless mold manufacturing method according to  claim 26 , and a fine shape is formed on a surface of the mold. 
     
     
         47 . A manufacturing method of a continuous film having a fine concavo-convex pattern on a surface of the film without a seam, wherein the film is manufactured using the seamless mold according to  claim 46 . 
     
     
         48 . A film having a fine concavo-convex pattern on a surface of the film, wherein the film is manufactured by the manufacturing method according to  claim 47 . 
     
     
         49 . A seamless mold, wherein a size of a fine shape of a surface of the mold is 1 μm or less. 
     
     
         50 . A manufacturing method of a continuous film having a fine shape pattern of 1 μm or less on a surface of the film without a seam, wherein the seamless mold according to  claim 49  is used. 
     
     
         51 . A film having a fine shape pattern, wherein the film is fabricated using the manufacturing method according to  claim 50 .