Electronic textile

Abstract

The invention relates to a textile ( 1 ) for mounting a first electronic component at a first designated position ( 121 ) on the textile, and for mounting a second electronic component at a second designated position ( 122 ) on the textile, the textile comprising a first marker pattern ( 111, 112 ) associated with the first designated position, and a second marker pattern ( 113, 114 ) associated with the second designated position. With the textile according to the invention, an electronic textile can be reliably manufactured using conventional equipment known from the electronics assembly industry, such as a pick-and-place apparatus, whereby the electronic components are properly provided at their respective designated positions on the textile.

1 . A textile for mounting a first electronic component at a first designated position on the textile and a second electronic component at a second designated position on the textile, wherein the textile comprises a first marker pattern associated with the first designated position and a second marker pattern associated with the second designated position. 
     
     
         2 . The textile according to  claim 1 , wherein the first marker pattern and the second marker pattern are detectable by using non-visible radiation. 
     
     
         3 . The textile according to  claim 1 , wherein the first marker pattern and the second marker pattern are detectable by using magnetic field detection. 
     
     
         4 . The textile according to  claim 1 , wherein the first marker pattern and the second marker pattern are formed from yarns that are woven into the textile. 
     
     
         5 . The textile according to  claim 1 , wherein the textile comprises a first layer and a second layer, the first layer being arranged to be provided with the electronic components, and the second layer comprising the first marker pattern and the second marker pattern. 
     
     
         6 . A method of manufacturing an electronic textile, comprising the steps of:
 providing a textile with a first marker pattern associated with a first designated position of a first electronic component, and a second marker pattern associated with a second designated position of a second electronic component,   providing the first electronic component,   aligning the textile relative to the first electronic component using the first marker pattern to prepare for placing the first electronic component at the first designated position,   placing the first electronic component onto the first designated position,   providing the second electronic component,   aligning the textile relative to the second electronic component using the second marker pattern to prepare for placing the second electronic component at the second designated position, and   placing the second electronic component onto the second designated position.   
     
     
         7 . The method according to  claim 6 , wherein the step of aligning the textile involves the use of an apparatus comprising a detector arranged to detect the first marker pattern and the second marker pattern. 
     
     
         8 . The method according to  claim 7 , wherein the detector is an optical detector. 
     
     
         9 . An apparatus for manufacturing an electronic textile comprising a holder for holding a textile, and an alignment tool for aligning the textile relative to a first electronic component by detecting on the textile a first marker pattern associated with a first designated position of the first electronic component, and relative to a second electronic component by recognizing on the textile a second marker pattern associated with a second designated position of the second electronic component. 
     
     
         10 . An electronic textile comprising a first electronic component, a second electronic component, and a textile comprising a first marker pattern associated with a first designated position and a second marker pattern associated with a second designated position, wherein the first electronic component is provided at the first designated position and the second electronic component is provided at the second designated position.