Method for inlaying gold ornament and housing made by the method

Abstract

A method for inlaying a gold ornament is disclosed. A substrate is provided which has an outer surface. A groove is defined in the substrate through the outer surface. A gold ornament is manufactured. The gold ornament has substantially the same shape as the groove. The gold ornament is placed in the groove wherein is positioned with metallic solder. Then the substrate is heated, whereby the melting and subsequent cooling of the solder bonds the gold ornament to the substrate. A housing for electronic device inlaid with a gold ornament made by the present method is also provided.

1 . A method for inlaying a gold ornament, comprising:
 providing a substrate, the substrate having an outer surface;   defining a groove in the substrate through the outer surface;   manufacturing a gold ornament having substantially the same shape as the groove;   placing metallic solder in the groove;   placing the gold ornament in the groove with the metallic solder; and   heating the substrate, whereby the melting and subsequent cooling of the solder bonds the gold ornament to the substrate.   
     
     
         2 . The method as claimed in  claim 1 , wherein the gold ornament is formed by numerical control of slow speed wire-cutting. 
     
     
         3 . The method as claimed in  claim 1 , wherein the metallic solder is tin paste or metallic powder. 
     
     
         4 . The method as claimed in  claim 1 , wherein the substrate is metal. 
     
     
         5 . The method as claimed in  claim 1 , wherein the groove is formed by a computer numerical controlled milling machine. 
     
     
         6 . The method as claimed in  claim 1 , wherein the gold ornament is coplanar with the outer surface when placed in the groove. 
     
     
         7 . The method as claimed in  claim 1 , wherein the gold ornament protrudes from the outer surface when placed in the groove. 
     
     
         8 . The method as claimed in  claim 6 , wherein the method further comprises treating the gold ornament to be coplanar with the outer surface after the heating step. 
     
     
         9 . A housing for electronic device, comprising:
 a substrate, the substrate defining a groove;   a gold ornament, the gold ornament being accommodated in the groove; and   a metallic solder positioned in the groove, the metallic solder bonding the gold ornament and the substrate.   
     
     
         10 . The housing as claimed in  claim 9 , wherein the metallic solder is tin paste or metallic powder. 
     
     
         11 . The housing as claimed in  claim 9 , wherein the metallic solder is formed on the bottom wall of the groove. 
     
     
         12 . The housing as claimed in  claim 9 , wherein the substrate is metal.