Manufacturing of optoelectronic devices

Abstract

A method for manufacturing optoelectronic devices is disclosed. A layered structure may be formed with a plurality of layers including a bottom electrode layer, a top electrode layer, and one or more active layers between the top and bottom electrode layers. The layered structure is divided into one or more separate device module sections by cutting through one or more of the layers of the layered structure. At least one of the layers is an unpatterned layer at the time of cutting. Each of the resulting device module sections generally includes a portion of the active layer disposed between portions of the top and bottom electrode layers. An edge of a device section may optionally be protected against undesired electrical contact between two or more of the bottom electrode, top electrode and active layer portions. Two or more device module sections may be assembled into a device and connected in series by electrically connecting the bottom electrode layer portion of one device section to the top electrode layer portion of another device module section.

1 . A method of manufacturing a moisture resistive photovoltaic module, comprising: providing two or more solar cells, each of the two or more solar cells having a back conductive surface and a front illuminated conductive surface that includes an active region and a contacting region, wherein a terminal layer that is conductive is disposed over the contacting region; forming a solar cell circuit by electrically interconnecting the two or more solar cells using interconnects, wherein a first end of each interconnect is attached to a portion of the terminal layer of each of the two or more solar cells to form a terminal structure for each of the two or more solar cells; forming a surface preparation layer providing as smooth a surface as an active region surface smoothness of the front illuminated conductive surface over the terminal structure of each of the two or more solar cells without substantially extending the surface preparation layer over the active region, the surface preparation layer covering at least the first end of the conductor of each of the two or more solar cells; and forming a moisture barrier layer over the active region and the surface preparation layer of each of the two or more solar cells. 
     
     
         2 . The method of  claim 1  wherein the terminal layer comprises at least one busbar and fingers and the first end of the conductor is attached to the at least one busbar. 
     
     
         3 - 4 . (canceled) 
     
     
         5 . The method of  claim 1 , further comprising encapsulating the solar cell circuit in a protective package. 
     
     
         6 . The method of  claim 1 , wherein the moisture barrier film comprises at least one of polyethylene, polypropylene, polystyrene, poly(ethylene terephthalate), polyimide, parylene, benzocyclobutene, polychlorotrifluoroethylene, silicon oxide, aluminum oxide, silicon nitride, aluminum nitride, silicon oxy-nitride, aluminum oxy-nitride, amorphous or polycrystalline silicon carbide, transparent ceramics, and carbon doped oxide. 
     
     
         7 . The method of  claim 1 , wherein the step of forming the moisture barrier layer comprises a chemical vapor deposition process. 
     
     
         8 . The method of  claim 7 , wherein the chemical vapor deposition process is an atomic layer deposition process. 
     
     
         9 - 11 . (canceled) 
     
     
         12 . A method of manufacturing a moisture resistive solar cell, comprising: providing a solar cell having a back surface and a front illuminated conductive surface that includes an active region and a contacting region, wherein a conductive terminal layer is disposed over the contacting region; attaching a first end of a conductor to a portion of the conductive terminal layer of the solar cell to form a terminal structure; forming a surface preparation layer providing as smooth a surface as an active region surface smoothness of the front illuminated conductive surface over the terminal structure without substantially extending the surface preparation layer over the active region, the surface preparation layer covering at least the first end of the conductor; and forming a moisture barrier layer over the active region and the surface preparation layer. 
     
     
         13 . The method of  claim 12 , wherein the conductive terminal layer comprises at least one busbar and fingers and the first end of the conductor is attached to the at least one busbar. 
     
     
         14 - 15 . (canceled) 
     
     
         16 . The method of  claim 12 , wherein the moisture barrier film comprises at least one of polyethylene, polypropylene, polystyrene, poly(ethylene terephthalate), polyimide, parylene, benzocyclobutene, polychlorotrifluoroethylene, silicon oxide, aluminum oxide, silicon nitride. aluminum nitride, silicon oxy-nitride, aluminum oxy-nitride, amorphous or polycrystalline silicon carbide, transparent ceramics, and carbon doped oxide. 
     
     
         17 . The method of  claim 12 , wherein the step of forming the moisture barrier layer comprises a chemical vapor deposition process. 
     
     
         18 . The method of  claim 17 , wherein the chemical vapor deposition process is an atomic layer deposition process. 
     
     
         19 - 20 . (canceled) 
     
     
         21 . A moisture resistive solar cell, comprising: a solar cell having a back surface and a front illuminated conductive surface that includes an active region and a contacting region over which a conductive terminal layer is disposed, wherein a first end of a conductor is attached to a portion of the terminal layer of the solar cell to form a terminal structure; a surface preparation layer that provides as smooth a surface as an active region surface smoothness of the front illuminated conductive surface formed over the terminal structure without substantially extending the surface preparation layer over the active region, the surface preparation layer covering at least the first end of the conductor; and a moisture barrier layer formed over the active region and the surface preparation layer. 
     
     
         22 - 26 . (canceled) 
     
     
         27 . The solar cell of  claim 21 , wherein the moisture barrier film comprises at least one of polyethylene, polypropylene, polystyrene, poly(ethylene terephthalate), polyimide, parylene, benzocyclobutene, polychlorotrifluoroethylene, silicon oxide, aluminum oxide, silicon nitride, aluminum nitride, silicon oxy-nitride, aluminum oxy-nitride, amorphous or polycrystalline silicon carbide, transparent ceramics, and carbon doped oxide. 
     
     
         28 . (canceled) 
     
     
         29 . A moisture resistive photovoltaic module, comprising: a solar cell circuit formed by electrically interconnecting two or more solar cells using interconnects, each of the two or more solar cells having a back conductive surface and a front illuminated conductive surface that includes an active region and a contacting region over which a conductive terminal layer is disposed, wherein a first end of each interconnect is attached to a portion of the terminal layer of each of the two or more solar cells to form a terminal structure for each of the two or more solar cells; a surface preparation layer that provides as smooth a surface as an active region surface smoothness of the front illuminated conductive surface formed over the terminal structure without extending over the active region, the surface preparation layer covering at least the first end of the conductor; and a moisture barrier layer formed over the front illuminated surface of each solar cell and the surface preparation layer. 
     
     
         30 - 31 . (canceled) 
     
     
         32 . The photovoltaic module of  claim 29 , further comprising a protective package in which the solar cell circuit is sealably embedded. 
     
     
         33 . The photovoltaic module of  claim 29 , wherein the terminal layer comprises at least one busbar and fingers and the first end of the conductor is attached to the at least one busbar. 
     
     
         34 . (canceled) 
     
     
         35 . The solar cell of  claim 33 , wherein each of the fingers are thinner in width than the at least one busbar, and wherein the surface preparation layer is disposed over only the busbar. 
     
     
         36 . The method of  claim 29 , wherein the moisture barrier film comprises at least one of polyethylene. polypropylene, polystyrene, poly(ethylene terephthalate), polyimide, parylene, benzocyclobutene, polychlorotrifluoroethylene, silicon oxide, aluminum oxide, silicon nitride aluminum nitride, silicon oxy-nitride, aluminum oxy-nitride, amorphous or polycrystalline silicon carbide, transparent ceramics, and carbon doped oxide 
     
     
         37 . The method of  claim 29 , wherein the interconnect is a copper ribbon.