Device for cooling semi-conductors

Abstract

The device serves for cooling electronic structural elements and has a cooling body and a metal base plate constructed as a part of the support of the structural element. The cooling body is arranged adjacent the base plate. A connecting element is arranged at least over areas between the base plate and the cooling body. The connecting element is at least partially constructed of a metal which has a melting temperature of at least 60° C. The connecting element is provided with a frame-like seal.

1 - 8 . (canceled) 
     
     
         9 . Device for cooling an electronic structural element, comprising; a cooling body; a metal base plate constructed as a part of a support of the structural element, the cooling body being arranged adjacent to the base plate; and a connecting element is arranged at least over areas between the base plate and the cooling body, wherein the connecting element is at least over areas thereof constructed of a metal which has a melting temperature of at least 60° C., and wherein the connecting element is provided with a frame-like seal. 
     
     
         10 . The device according to  claim 9 , wherein the seal is of a metal having a melting temperature above 200° C. 
     
     
         11 . The device according to  claim 9 , wherein the connecting element is constructed to be foil-like. 
     
     
         12 . The device according to  claim 9 , wherein at least one recess is arranged in the area of the connecting element. 
     
     
         13 . The device according to  claim 9 , wherein at least one material thickness reduction is arranged in the area of the connecting element. 
     
     
         14 . The device according to  claim 9 , wherein the connecting element extends at least over areas thereof at a distance from the seal. 
     
     
         15 . The device according to  claim 9 , wherein at least one recess is arranged in the area of the seal facing the connecting element. 
     
     
         16 . The device according to  claim 11 , wherein the seal has a greater height in a direction extending transversely of the cooling body than a thickness of the metal foil.