US2011063450A1PendingUtilityA1

Camera module

Assignee: SAMSUNG ELECTRO MECHPriority: Aug 6, 2008Filed: Nov 9, 2010Published: Mar 17, 2011
Est. expiryAug 6, 2028(~2 yrs left)· nominal 20-yr term from priority
Inventors:Min Chul Go
H10W 90/754H04N 23/57G03B 17/02G03B 11/00H10W 72/011
37
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Claims

Abstract

A camera module including a housing that includes one or more lenses which are sequentially fixed and coupled and of which the focus does not need to be adjusted; a holder assembly that is coupled to a lower end portion of the housing; and a main substrate that is coupled to a lower end portion of the holder assembly through a reflow process, wherein the holder assembly includes a holder including a housing mounting portion, and a filter mounting portion that is formed in such a manner that an internal space of the holder is sealed by an IR filter.

Claims

exact text as granted — not AI-modified
1 . A camera module comprising:
 a housing that includes one or more lenses which are sequentially fixed and coupled and of which the focus does not need to be adjusted;   a holder assembly that is coupled to a lower end portion of the housing; and   a main substrate that is coupled to a lower end portion of the holder assembly through a reflow process,   wherein the holder assembly includes a holder including a housing mounting portion that is formed on an upper end portion of the holder such that fine focus adjustment can be performed in a sliding manner when the holder assembly is coupled to the lower end portion of the housing, and a filter mounting portion that is formed in such a manner that an internal space of the holder is sealed by an IR filter, the holder being formed of a ceramic material on which a reflow process can be performed,   the IR filter is mounted on the filter mounting portion formed in the holder, and   a holder substrate is coupled to a lower end portion of the holder and includes an image sensor fixed on an upper surface thereof through wire bonding and bonding media for bonding the main substrate through a reflow process, the bonding media being provided on a lower surface of the holder substrate.   
     
     
         2 . The camera module according to  claim 1 , wherein the housing includes a support portion which extends from an inner lower end of the housing so as to come in contact with the upper end portion of the holder assembly. 
     
     
         3 . The camera module according to  claim 2 , wherein the support portion extends so as to be disposed on an upper end portion of the IR filter. 
     
     
         4 . The camera module according to  claim 1 , wherein the filter mounting portion is formed on an inner surface of the upper end portion of the holder. 
     
     
         5 . The camera module according to  claim 1 , wherein the filter mounting portion is formed on an inner surface of a middle portion of the holder. 
     
     
         6 . The camera module according to  claim 1 , further comprising:
 passive elements provided on the holder substrate positioned outside the holder.   
     
     
         7 . The camera module according to  claim 1 , wherein the bonding media formed on the lower surface of the holder substrate are solder balls or pads.

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