Low cost die placement

Abstract

Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, using a release member having a phase change material. Specifically, IC elements/components can be selectively received, stored, inspected, repaired, and/or released in a scalable manner during the assembly of IC chips by inducing phase change of the phase change material. The release member can be flexible or rigid. In some embodiments, the release member can be used for a low cost placement of the IC elements in combination with an SOI (silicon on insulator) wafer and/or an intermediate transfer member. In other embodiments, the release member can be used for a low cost placement of the IC elements in combination with a release wafer.

1 . An integrated circuit sub-assembly comprising:
 a release member supporting one or more transferred IC elements;   an activatable thermal barrier layer formed on the release member, wherein the activatable thermal barrier material is provided between the one or more IC elements and the release member; and   an energy source directed at said activatable thermal barrier layer, wherein said energy source activates said activatable thermal barrier layer and releases each transferred IC element from the release member.   
     
     
         2 . The integrated circuit sub-assembly of  claim 1 , wherein the release member comprises an intermediate transfer member re-orienting said one or more transferred IC elements. 
     
     
         3 . The integrated circuit subassembly of  claim 1 , wherein the release member comprises a roll-to-roll material.