US2011068878A1PendingUtilityA1

Power distribution system for integrated circuits

Assignee: TERASPEED CONSULTING GROUP LLCPriority: Jun 6, 2006Filed: Aug 5, 2010Published: Mar 24, 2011
Est. expiryJun 6, 2026(expired)· nominal 20-yr term from priority
H05K 3/429H05K 2201/10734H05K 1/141H05K 2201/10378H05K 2201/09254H05K 1/0263H05K 2201/09781H05K 1/0237H05K 1/116H05K 2201/09309H05K 1/0231H05K 2201/049H10W 90/724H10W 44/20
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Claims

Abstract

A power distribution system for integrated circuits includes methods to damp resonance between a bypass capacitor network and a power/ground cavity of the printed circuit board that (a) does not require excessive quantities of bypass/damping components or (b) does not require high plane cavity capacitance or in the alternative can insure a Q of less than 1.4 at the transition from the bypass network to the plane cavity impedance cross-over.

Claims

exact text as granted — not AI-modified
1 . An interposer comprising:
 a substrate having first and second surfaces; and   a shunt network; wherein   the first surface is arranged to be attachable to a circuit board;   the second surface is arranged to be connectable to an integrated circuit package; and   the shunt network has a series resonant frequency at or near a parallel resonant frequency of a first component having an inductance L first  and of a second component having a capacitance C second  of a power wiring network to which the interposer will be connected.   
     
     
         2 . An interposer according to  claim 1 , wherein the substrate includes at least one wing. 
     
     
         3 . An interposer according to  claim 1 , wherein the shunt network has a Q factor of about 2 or less. 
     
     
         4 . An interposer according to  claim 1 , wherein the shunt network has a Q factor of about 1.4 or less. 
     
     
         5 . An interposer according to  claim 1 , wherein reactive elements of the shunt network have a characteristic impedance more than 2.0×√(L first /C second ). 
     
     
         6 . An interposer according to  claim 1 , wherein the shunt network is arranged to suppress or eliminate resonant behavior of a power wiring network by altering a net phase characteristics of the power wiring network when the shunt network is connected to the power wiring network. 
     
     
         7 . An interposer according to  claim 1 , wherein the shunt network includes a plurality of branches;
 each of the plurality of branches has its own zero such that the self impedance of the shunt network remains within 135° electrical of a power wiring network self-impedance phase at any point in the power wiring network when the shunt network is connected to the power wiring network.   
     
     
         8 . An interposer according to  claim 1 , wherein the shunt network is arranged to be insertable in series between the first component and the second component. 
     
     
         9 . An interposer according to  claim 1 , wherein the shunt network, when loaded by the first component, has a parallel resonant frequency at or near a parallel resonant frequency of the first component and the second component. 
     
     
         10 . An interposer according to  claim 1 , wherein the shunt network includes a group of networks; and
 at least one of the group of networks is composed of a plurality of capacitors.   
     
     
         11 . An interposer according to  claim 10 , wherein capacitances of the plurality of capacitors span a narrow range using multiple successive E12 series values. 
     
     
         12 . An interposer comprising:
 a substrate having first and second surfaces;   a via disposed in the substrate; and   a first series of quarter-wave resonator stubs connected to the via; wherein   the first surface is arranged to be connectable to a circuit board;   the second surface is arranged to be connectable to an integrated circuit package; and   frequencies of the first series of quarter-wave resonator stubs correspond to half wave resonances of a power wiring network when the power wiring network is not compensated.   
     
     
         13 . An interposer according to  claim 12 , wherein impedances of the first series of quarter-wave resonator stubs linearly ascend in values with frequency to minimize the negative impact of half-wave resonance modes that result from each of the first series of quarter-wave resonator stubs. 
     
     
         14 . An interposer according to  claim 12 , further comprising a second series of quarter-wave resonator stubs arranged to compensate half-wave resonances resulting from the first series of quarter-wave resonator stubs.

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