Heat dissipating device

Abstract

A heat dissipating device includes a heat sink and a heat sink cover. The heat sink includes a base and a plurality of fins extending from the base. Each of the plurality of fins includes a corner projection. The heat sink cover covers the corner projections of the heat sink.

1 . A heat dissipating device, comprising:
 a heat sink comprising a base and a plurality of fins extending from the base, each of the plurality of fins comprising a corner projection; and   a heat sink cover covering the corner projections of the heat sink for avoiding the corner projections to be exposed.   
     
     
         2 . The heat dissipating device of  claim 1 , wherein the heat sink cover comprises a first wall and a second wall extending from the first wall, a receiving space is corporately defined by the first wall and the second wall, the receiving space receives the corner projections of the heat sink. 
     
     
         3 . The heat dissipating device of  claim 2 , wherein each of the plurality of fins comprises a first edge and a second edge connecting the first edge, the corner projection is corporately defined by the first edge and the second edge. 
     
     
         4 . The heat dissipating device of  claim 3 , wherein the first wall contacts the first edge and the second wall contacts the second edge. 
     
     
         5 . The heat dissipating device of  claim 3 , wherein the first wall is perpendicular to the second wall, and each of the plurality of fins is generally rectangle-shaped, the first edge is perpendicular to the second edge. 
     
     
         6 . The heat dissipating device of  claim 1 , wherein the heat sink cover is ring-shaped and surrounds the corner projections of the heat sink. 
     
     
         7 . The heat dissipating device of  claim 1 , wherein the heat sink defines a securing hole therein, and the heat sink cover comprises a mounting portion, the mounting portion defines a through hole corresponding to the securing hole of the heat sink. 
     
     
         8 . The heat dissipating device of  claim 7 , further comprising a fan placed on the heat sink, the heat sink cover disposed between the heat sink and the fan. 
     
     
         9 . The heat dissipating device of  claim 8 , wherein the fan comprises a securing portion, the securing portion defines a securing hole therein corresponding to the through hole of the heat sink cover. 
     
     
         10 . The heat sink dissipating device of  claim 7 , wherein the heat sink comprises a second mounting portion, the second mounting portion defining the securing hole therein, the heat sink cover comprising a receiving portion receiving the second mounting portion. 
     
     
         11 . The heat sink dissipating device of  claim 1 , wherein the cross section of the heat sink cover is L-shaped. 
     
     
         12 . The heat sink dissipating device of  claim 1 , wherein the heat sink comprises a fastener for securing the heat sink to a printed circuit board, and the heat sink cover defines an opening corresponding to the fastener of the heat sink. 
     
     
         13 . The heat sink dissipating device of  claim 1 , wherein the plurality of fins radially extends from the base. 
     
     
         14 . A heat sink cover, comprising:
 a first wall; and   a second wall extending from the first wall;   wherein a receiving space is corporately defined by the first wall and the second wall, the receiving space is capable of receiving corner projections of fins of a heat sink for avoiding the corner projections to be exposed.   
     
     
         15 . The heat sink cover of  claim 14 , wherein the cross section of the heat sink cover is L-shaped. 
     
     
         16 . The heat sink cover of  claim 14 , wherein the heat sink cover is ring-shaped for surrounding the corner projections of the heat sink. 
     
     
         17 . The heat sink cover of  claim 14 , wherein the first wall is perpendicular to the second wall.