Low-lead copper alloy

Abstract

The present invention provides a low-lead copper alloy, which includes 0.05 to 0.3 wt % of lead, 0.3 to 0.8 wt % of aluminum, 0.01 to 3 wt % of bismuth, 1 to 4 wt % of silicon, 0.1 to 1 wt % of tin, and more than 93.6% of copper and zinc, wherein copper is in an amount ranging from 61 to 78 wt %. The low-lead copper alloy of the present invention has excellent toughness and processability, and can provide increased resistance in an environment with a high concentration of chlorine ions.

1 . A low lead copper alloy, comprising:
 0.05 to 0.3 wt % of lead;   0.3 to 0.8 wt % of aluminum;   0.01 to 0.3 wt % of bismuth;   1 to 4 wt % of silicon;   0.1 to 1 wt % of tin; and   more than 93.6% of copper and zinc, wherein the copper is in an amount ranging from 61 to 78 wt %.   
     
     
         2 . The low lead copper alloy of  claim 1 , wherein the lead is in an amount ranging from 0.15 to 0.25 wt %. 
     
     
         3 . The low lead copper alloy of  claim 1 , wherein the aluminum is in an amount ranging from 0.5 to 0.65 wt %. 
     
     
         4 . The low lead copper alloy of  claim 1 , wherein the bismuth is in an amount ranging from 0.1 to 0.2 wt %. 
     
     
         5 . The low lead copper alloy of  claim 1 , wherein the silicon is in an amount ranging from 2 to 3 wt %. 
     
     
         6 . The low lead copper alloy of  claim 1 , wherein the copper is in an amount ranging from 66 to 72 wt %. 
     
     
         7 . The low lead copper alloy of  claim 1 , wherein the copper is in an amount ranging from 62 to 74 wt %.