System and method for preventing metal corrosion on bond pads

Abstract

A system and method are disclosed for preventing metal corrosion on bond pads. During manufacture of an integrated circuit device an anti-reflective coating (ARC) layer is applied to a metal stack of a bond pad. A mask and etch process is applied to etch an aperture through the ARC layer down to the metal stack. Then a passivation layer is applied to cover the ARC layer and the aperture through the ARC layer. Then another mask and etch process is applied to etch a bond pad opening through the passivation layer inside the ARC layer aperture down to the metal stack. Interior edge portions of the passivation layer seal the interior edge portions of the ARC layer aperture to prevent corrosion of the ARC layer due to high temperatures, high humidity and corrosive materials encountered in subsequent assembly operations of the integrated circuit device.

1 - 7 . (canceled) 
     
     
         8 . An integrated circuit device comprising at least one bond pad that comprises:
 a metal stack;   an anti-reflective coating layer on said metal stack, said anti-reflective coating layer having portions that define an anti-reflective coating layer aperture through said anti-reflective coating layer down to said metal stack; and   a passivation layer over said anti-reflective coating layer that seals interior edges of said anti-reflective coating layer aperture from an ambient atmosphere.   
     
     
         9 . The integrated circuit device as set forth in  claim 8 , wherein said passivation layer comprises portions that form a bond pad opening through said passivation layer down to said metal stack. 
     
     
         10 . The integrated circuit device as set forth in  claim 9 , wherein interior edges of said passivation layer that form said bond pad opening through said passivation layer cover said interior edges of said anti-reflective coating layer. 
     
     
         11 . The integrated circuit device as set forth in  claim 10 , wherein said portions of said passivation layer protect said interior edges of said anti-reflective coating layer aperture from at least one of: a high temperature and a high humidity of said ambient atmosphere associated with subsequent assembly operations of said integrated circuit. 
     
     
         12 . The integrated circuit device as set forth in  claim 10 , wherein said portions of said passivation layer protect said interior edges of said anti-reflective coating layer aperture from corrosive materials used in subsequent assembly operations of said integrated circuit device. 
     
     
         13 . The integrated circuit device as set forth in  claim 8 , wherein said passivation layer over said anti-reflective coating layer that seals said interior edges of said anti-reflective coating layer aperture from said ambient atmosphere prevents corrosion of said anti-reflective coating layer on said bond pad. 
     
     
         14 .- 20 . (canceled)