US2011090332A1PendingUtilityA1

Image sensor device, apparatus and method for optical measurement

47
Assignee: SENSOVATION AGPriority: Sep 25, 2000Filed: Nov 18, 2010Published: Apr 21, 2011
Est. expirySep 25, 2020(expired)· nominal 20-yr term from priority
Inventors:Paul Hing
H04N 25/76H04N 25/745H04N 25/7795H04N 25/78H04N 25/47G01J 3/0286G01J 3/02G01J 3/2803
47
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Claims

Abstract

The invention relates to an apparatus and processes for optical measurement and detection with real-time closed-loop controls, which enable higher levels of performance. The invention is especially suitable for applications such as spectroscopy; microscopy; biochemical assays; processes and reactions on miniaturized formats (such as those involving micro-/nano-plates, micro-formats & micro-arrays, chemistry-on-chip, lab-on-chip, micro-channels and micro-fluidics, where dimensions are on micron scale and volumes are in the sub-nanoliter range). Such “intelligent sensing” allows higher data quality and reliability, higher measurement and analysis throughput and lower cost. The invention uses fast real-time adaptive digital signal processing and controls directly at the point where data is sensed. Through real-time adaptive control of sensors, chemical/opto-mechanical/opto-electronic processes and other components during the measurement process, consistently higher quality results and higher reliability are achieved. This invention furthermore includes an improved image sensor architecture that enables very high intra-array dynamic range at fast frame rates and low noise performance.

Claims

exact text as granted — not AI-modified
1 - 39 . (canceled) 
     
     
         40 . An apparatus for optical measurements, real-time imaging, sensing, detection, or controlling, comprising:
 a single or a plurality of image sensors;   digital logic means to drive said image sensors as well as a direct I/O control;   a processor mechanism, to derive a result from an image, use the result to determine optimal sensor parameters and feed back the optical sensor parameters to the single or plurality of image sensors in an autonomous and continuous fashion until the result is optimized, for performing high-speed closed-loop digital control of said image sensors, the processor mechanism performing high-speed real-time control of image sensor parameters via direct interface to said digital logic means; and   at least one signal optimization system, comprising at least one of a chemical, mechanical, opto-mechanical or opto-electronic component or process which affect any signals to be optimized, said digital logic means to drive at least one of said chemical, mechanical, opto-mechanical and opto-electronic components and processes;   wherein said processor mechanism is placed directly at said image sensor such that output data from said image sensor is immediately processed and evaluated.   
     
     
         41 . The apparatus according to  claim 40 , wherein said image sensor parameters comprise at least one of integration time, pixel binning, sensor readout pattern and timing. 
     
     
         42 . The apparatus according to  claim 40 , wherein said processor mechanism comprises firmware, software or software algorithms, which are re-programmable and changeable at any time by an external host computer. 
     
     
         43 . The apparatus according to  claim 40 , wherein said processor mechanism comprises an embedded micro-controller system and software. 
     
     
         44 . The apparatus according to  claim 40 , wherein said processor mechanism comprises an electronics and software system based on a single or a plurality of Digital Signal Processors (DSP). 
     
     
         45 . The apparatus according to  claim 40 , wherein said processor mechanism comprises:
 a Digital Signal Processor (DSP) for performing data processing and high-speed digital control functions, and   an embedded micro-controller system for performing communications and multi-tasking functions and being a host to said DSP.   
     
     
         46 . The apparatus according to  claim 40 , wherein said image sensor comprises one or a plurality of image sensor devices. 
     
     
         47 . The apparatus according to  claim 40 , wherein said image sensor comprises one or a plurality of Charge Coupled Devices (CCD). 
     
     
         48 . The apparatus according to  claim 40 , wherein said image sensor comprises a Complimentary Metal Oxide Semiconductor (CMOS) image sensor. 
     
     
         49 . The apparatus according to  claim 40 , wherein said image sensor comprises a Charge Injection Device (CID) image sensor. 
     
     
         50 . The apparatus according to  claim 46 , wherein said processor mechanism additionally comprises hardware logic for high-speed signal processing, said hardware logic performing real-time in-line data correction, such that pixel values are processed with no decrease in pixel rate during data acquisition, and wherein functionality and algorithms implemented in said hardware logic are programmable and changeable at any time by an external host. 
     
     
         51 . The apparatus according to  claim 50 , wherein said hardware logic performs real-time correction of variations in an optical response of individual pixels or of binned sub-areas of pixels of said image sensor devices, and wherein said hardware logic uses calibration data pre-stored in said apparatus to perform data processing algorithms. 
     
     
         52 . The apparatus according to  claim 46 , wherein said apparatus comprises hardware and software necessary for Ethernet or Internet communications, or wherein said apparatus can be controlled and programmed, and can transfer data, over said Ethernet or Internet. 
     
     
         53 . The apparatus according to  claim 46 , further comprising cooling means for cooling said image sensor devices, said cooling means comprise at least one package in which one or several image sensor devices are thermo-electrically cooled and sealed in a hermetic manner, said package configured to accommodate off-the-shelf non-cooled image sensors packaged in standard I.C. packages, and further allowing for the image sensor device to be removed or replaced.

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