Method for producing perforated or partially perforated stencils with a relief

Abstract

A method for producing a stencil, which has on its upper side a relief with a multiplicity of openings, the contours of which correspond to a desired pattern, and to a stencil of this type. In order to permit greater relief heights, and consequently increased freedom of design of patterns to be applied, the stencil is provided with a body having at least one non-perforated non-metal relief layer. The material of the relief layer is removed according to the pattern by laser or plasma radiation to form the multiplicity of openings of the relief. Through-openings which extend to a rear side opposite from the upper side are provided at least in the bottom region of the openings of the relief. A stencil with a stencil body ( 10 ) may be obtained, which has at least one non-metal relief layer, formed in the upper side of which is a relief with a multiplicity of openings, the contours of which correspond to a desired pattern. Through-openings which extend to a rear side opposite from the upper side are provided here at least in the bottom region of the openings of the relief.

1 . A method for producing a stencil, which has on its upper side a relief ( 11 ) with a multiplicity of openings ( 12 ), the contours of which correspond to a desired pattern, with the following steps:
 providing a stencil body ( 10 ), which has at least one non-metal relief layer ( 11 ), and   removing the material of the relief layer ( 11 ) according to the pattern by means of laser or plasma radiation to form the multiplicity of openings ( 12 ) of the relief, through-openings ( 14 ) which extend to a rear side opposite from the upper side being provided at least in the bottom region ( 13 ) of the openings ( 12 ) of the relief.   
     
     
         2 . The method as claimed in  claim 1 , the stencil body ( 10 ) having no carrier layer ( 15 ) or a non-perforated metal or non-metal carrier layer on the rear side of the relief layer and the through-openings ( 14 ) that are provided at least in the bottom region ( 13 ) of the openings ( 12 ) of the relief being introduced into the stencil body ( 10 ) by means of laser radiation. 
     
     
         3 . The method as claimed in  claim 1 , the stencil body ( 10 ) having a perforated carrier layer ( 15 ), particularly a metal screen, on the rear side of the relief layer ( 11 ) and the through-openings ( 14 ) that are provided at least in the bottom region ( 13 ) of the openings ( 12 ) of the relief being formed by at least partial exposure of the openings ( 14 ) in the carrier layer ( 15 ) by means of laser radiation. 
     
     
         4 . The method as claimed in  claim 3 , the through-openings ( 14 ) in the bottom region ( 13 ) of the openings ( 12 ) of the relief being exposed by completely removing the relief layer ( 11 ). 
     
     
         5 . The method as claimed in  claim 3 , non-pattern-forming openings or perforations being introduced into the relief layer ( 11 ) in a plateau region ( 16 ) outside the openings ( 12 ) of the relief by means of laser radiation, these non-pattern-forming openings being congruent with the openings ( 14 ) of the carrier layer ( 15 ), to form through-openings ( 14 ). 
     
     
         6 . The method as claimed in  claim 3 , non-pattern-forming openings or perforations being introduced into the relief layer ( 11 ) in a plateau region ( 16 ) outside the openings ( 12 ) of the relief by means of laser radiation, these non-pattern-forming openings differing in shape, size and/or arrangement from the openings ( 14 ) of the carrier layer ( 15 ), to form through-openings ( 14 ). 
     
     
         7 . The method as claimed in  claim 1 , material of the relief layer ( 11 ) also being removed by means of laser radiation outside the openings ( 12 ), so that plateau regions ( 16 ) outside the openings ( 12 ) of the relief have different heights. 
     
     
         8 . The method as claimed in  claim 1 , walls of the openings ( 12 ) being inclined, beveled, rounded or graduated in the form of steps with respect to the surrounding plateau region ( 16 ) when forming the openings ( 12 ). 
     
     
         9 . The method as claimed in  claim 8 , the transitions between the openings ( 12 ) and the plateau regions ( 16 ) of the relief layer ( 11 ) being inclined, beveled, rounded or graduated in the form of steps by modulation of the radiation power density. 
     
     
         10 . The method as claimed in  claim 1 , the surface of the plateau regions ( 16 ) outside the openings ( 12 ) being provided with a regular, random or pseudo-random microstructure. 
     
     
         11 . The method as claimed in  claim 1 , the surface of the plateau regions ( 16 ) or the entire exposed surface of the relief layer ( 11 ) being provided with a coating ( 17 ). 
     
     
         12 . The method as claimed in  claim 11 , the coating ( 17 ) consisting of metal, which is applied chemically, galvanically or by spraying or printing techniques. 
     
     
         13 . A stencil with a stencil body ( 10 ), which has at least one non-metal relief layer ( 11 ), in the surface of which there is formed a relief with a multiplicity of openings ( 12 ), the contours of which correspond to a desired pattern, through-openings ( 14 ) which extend to a rear side opposite from the upper side being provided at least in the bottom region ( 13 ) of the openings ( 12 ) of the relief. 
     
     
         14 . The stencil as claimed in  claim 13 , the stencil body ( 10 ) having on the rear side of the relief layer ( 11 ) a non-perforated metal or non-metal carrier layer ( 15 ), which is provided with through-openings ( 14 ) at least in the bottom region ( 13 ) of the openings ( 12 ) of the relief. 
     
     
         15 . The stencil as claimed in  claim 14 , the carrier layer ( 15 ) consisting of glass- or carbon-fiber reinforced metal or non-metal. 
     
     
         16 . The stencil as claimed in  claim 13 , the stencil body ( 10 ) having on the rear side of the relief layer ( 11 ) a perforated carrier layer ( 15 ), particularly a metal screen, the through-openings ( 14 ) of which are at least partially exposed, at least in the bottom region ( 13 ) of the openings ( 12 ) of the relief. 
     
     
         17 . The stencil as claimed in  claim 16 , the relief layer ( 11 ) having non-pattern-forming through-openings ( 18 ) or perforations in a plateau region ( 16 ) outside the openings ( 12 ) of the relief, these non-pattern-forming openings being introduced by means of laser radiation and congruent with the openings ( 14 ) of the carrier layer ( 15 ). 
     
     
         18 . The stencil as claimed in  claim 16 , the relief layer ( 11 ) having non-pattern-forming through-openings ( 18 ) or perforations in a plateau region ( 16 ) outside the openings ( 12 ) of the relief, these non-pattern-forming openings being introduced by means of laser radiation and differing in shape, size and/or arrangement from the openings ( 14 ) of the carrier layer ( 15 ). 
     
     
         19 . The stencil as claimed in  claim 16 , the metal screen being produced galvanically. 
     
     
         20 . The stencil as claimed in  claim 16 , the metal screen consisting of a wire gauze with a galvanic surface coating. 
     
     
         21 . The stencil as claimed in  claim 13 , plateau regions ( 16 ) outside the openings ( 12 ) of the relief having different heights. 
     
     
         22 . The stencil as claimed in  claim 13 , walls of the openings ( 12 ) being inclined, beveled, rounded or graduated in the form of steps with respect to the surrounding plateau region ( 16 ). 
     
     
         23 . The stencil as claimed in  claim 13 , the surface of the plateau regions ( 16 ) outside the openings ( 12 ) being provided with a regular, random or pseudo-random microstructure. 
     
     
         24 . The stencil as claimed in  claim 13 , the surface of the plateau regions ( 16 ) or the entire exposed surface of the relief layer ( 11 ) being provided with a coating ( 17 ).