Semiconductor light emitting module and method of manufacturing the same

Abstract

Provided are a semiconductor light emitting module and a method of manufacturing the same, which allow achieving high luminance light emission as well as lightweight and compact features. In a semiconductor light emitting module ( 101 ), a projecting portion ( 202 ) serving as a reflecting member is formed on a metal thin plate ( 102 ) to surround a semiconductor light emitting element ( 104 ). The semiconductor light emitting element ( 104 ) is connected to a printed board ( 103 ) by using a wire ( 201 ), for example. The projecting portion ( 202 ) is formed by pressing and bending the metal thin plate ( 102 ) from a back surface, for example, to surround the element and to be higher than the semiconductor light emitting element ( 104 ).

1 . A semiconductor light emitting module comprising:
 a semiconductor light emitting element;   a plate on which each semiconductor light emitting element is disposed in contact with a surface of the plate; and   a board for covering a certain portion of the surface of the plate excluding a portion for each semiconductor light emitting element and a neighborhood of the element, being electrically connected to each semiconductor light emitting element, and supplying the electric power, the board partially exposing the plate by being formed to cover the certain portion of the plate having an area smaller than a portion of the plate excluding the portion for each semiconductor light emitting element and the neighborhood of the element.   
     
     
         2 . The semiconductor light emitting module according to  claim 1 , wherein the plate has a high reflection coating formed on the surface thereof so as to reflect light from the semiconductor light emitting element. 
     
     
         3 . A semiconductor light emitting module comprising:
 a plurality of semiconductor light emitting elements;   a plurality of plates on which the respective semiconductor light emitting elements are disposed in contact with surfaces of the plates; and   a single board for covering certain portions of the surfaces of the respective plurality of plates excluding portions for the respective semiconductor light emitting elements and neighborhoods of the elements, being electrically connected to the semiconductor light emitting elements, and supplying the electric power, the board connecting the plurality of plates to each other and partially exposing the plate by being formed to cover the certain portion of each of the plates having an area smaller than a portion of the plate excluding the portion for the corresponding semiconductor light emitting element and the neighborhood of the element.   
     
     
         4 . The semiconductor light emitting module according to  claim 3 ,
 wherein the plurality of plates are disposed in an array fashion, and   a width of each of the plurality of plates longitudinally arranged in the array fashion is greater than a width of the single board.   
     
     
         5 . The semiconductor light emitting module according to  claim 3 , wherein each of the plates has a high reflection coating formed on the surface thereof so as to reflect light from the corresponding semiconductor light emitting element. 
     
     
         6 . A semiconductor light emitting module comprising:
 a semiconductor light emitting element;   a plate on which the semiconductor light emitting element is disposed in contact with a surface of the plate, in a region surrounded by a projecting portion formed to have an inclined surface forming an obtuse angle with the surface and to be higher than the semiconductor light emitting element;   a board for covering a certain portion of the surface of the plate excluding the region surrounded by the projecting portion, being electrically connected to each semiconductor light emitting element, supplying the electric power; and   a high reflection paint portion formed by stamping or coating high reflection paint in a contact position between the projecting portion and the board so as to reflect light from the semiconductor light emitting element.   
     
     
         7 . The semiconductor light emitting module according to  claim 6 , wherein the plate has a high reflection coating formed on the surface thereof so as to reflect light from the semiconductor light emitting element. 
     
     
         8 . (canceled) 
     
     
         9 . The semiconductor light emitting module according to  claim 6 , further comprising:
 a convex reflector provided on the board outside the region surrounded by the projecting portion so as to surround the region, the convex reflector obtained by forming a reflective material into a convex shape.   
     
     
         10 . A semiconductor light emitting module manufacturing method for manufacturing a semiconductor light emitting module in which a semiconductor light emitting element is integrally incorporated, the method comprising the steps of:
 forming a projecting portion on a plate, the projecting portion including an inclined surface forming an obtuse angle formed with a surface of the plate, the projecting portion being higher than the semiconductor light emitting element;   disposing the semiconductor light emitting element in a region surrounded by the projecting portion so that the semiconductor light emitting element is in contact with the surface of the plate;   disposing a board covering a certain portion of the surface of the plate excluding the region surrounded by the projecting portion, being electrically connected to the semiconductor light emitting element, and supplying electric power; and   a high reflection paint forming step of making formation by stamping or applying high reflection paint to a contact position between the projecting portion and the board to reflect light from the semiconductor light emitting element.   
     
     
         11 . The semiconductor light emitting module manufacturing method according to  claim 10 , wherein, in the step of forming a projecting portion, the projecting portion is formed into such a shape as to reflect and condense light emitted from the semiconductor light emitting element. 
     
     
         12 . The semiconductor light emitting module manufacturing method according to  claim 10 , wherein the plate is formed to reflect light from the semiconductor light emitting element by forming a high reflection coating. 
     
     
         13 . (canceled) 
     
     
         14 . A semiconductor light emitting module comprising:
 a semiconductor light emitting element;   a plate on which the semiconductor light emitting element is disposed in contact with a surface of the plate;   a board for covering a certain portion of the surface of the plate excluding a certain region including a portion where the semiconductor light emitting element is disposed, being electrically connected to each semiconductor light emitting element, and supplying the electric power; and   a paint portion formed to reflect light from the semiconductor light emitting element, by applying high reflection paint to cover a gap formed between the board and the plate in contact with each other in a periphery of the certain region.   
     
     
         15 . The semiconductor light emitting module according to  claim 14 , wherein the plate has a high reflection coating formed on the surface thereof so as to reflect light from the semiconductor light emitting element. 
     
     
         16 . The semiconductor light emitting module according to  claim 9 , wherein resin containing a light-emitting agent efficiently irradiating light from the semiconductor light emitting element is applied to the metal plate and the board in a region whose periphery is the convex reflector. 
     
     
         17 . The semiconductor light emitting module according to  claim 9 , further comprising:
 a light guide plate disposed to cover a portion surrounded by the convex reflector and configured to guide light emitted from the semiconductor light emitting element.   
     
     
         18 . The semiconductor light emitting module according to  claim 9 , wherein that the plate is substantially flat except for the convex reflector. 
     
     
         19 . The semiconductor light emitting module manufacturing method according to  claim 10 , further comprising:
 a convex reflector forming step of forming a convex reflector on the board outside the region surrounded by the projecting portion to surround the region, the convex reflector obtained by forming a reflective material into a convex shape.   
     
     
         20 . The semiconductor light emitting module manufacturing method according to  claim 19 , further comprising the step of:
 applying resin to the metal plate and the board in a region whose periphery is the convex reflector, the resin containing a light-emitting agent efficiently irradiating light from the semiconductor light emitting element.   
     
     
         21 . The semiconductor light emitting module manufacturing method according to  claim 19 , further comprising the step of:
 disposing a light guide plate so that the light guide plate covers a portion surrounded by the convex reflector and guiding light emitted from the semiconductor light emitting element.   
     
     
         22 . The semiconductor light emitting module manufacturing method according to  claim 19 , wherein, in the convex reflector forming step, the convex reflector is formed such that the plate is substantially flat except for the convex reflector.