Three-layered cold/hot controller

Abstract

A three-layered cold/hot controller comprises a semiconductor plate, a first metal plate, and a second metal plate. The semiconductor plate has a top and a bottom contact surface and connected with a power source. When the semiconductor plate is electrified, the top contact surface of the semiconductor plate forms a contact surface for decreasing temperature while the bottom contact surface of the semiconductor plate forms a contact surface for elevating temperature. The first metal plate is combined to the top contact surface of the semiconductor plate for conducting the heat between the first metal plate and the top contact surface. The second metal plate is combined to the bottom contact surface of the semiconductor plate for conducting the heat between the second metal plate and the bottom contact surface.

1 . A three-layered cold/hot controller, comprising:
 a semiconductor plate, having a top and a bottom contact surface and connected with a power source, where when the semiconductor plate is electrified, the top contact surface of the semiconductor plate forms a contact surface for decreasing temperature while the bottom contact surface of the semiconductor plate forms a contact surface for elevating temperature;   a first metal plate, combined to the top contact surface of the semiconductor plate for conducting the heat between the first metal plate and the top contact surface; and   a second metal plate, combined to the bottom contact surface of the semiconductor plate for conducting the heat between the second metal plate and the bottom contact surface.   
     
     
         2 . The three-layered cold/hot controller as claimed in  claim 1 , wherein the first and the second metal plates are copper alloy plates with high thermal conductivity coefficient. 
     
     
         3 . The three-layered cold/hot controller as claimed in  claim 1 , wherein the second metal plate is further connected with a heat dissipation device thereon. 
     
     
         4 . The three-layered cold/hot controller as claimed in  claim 3 , wherein the heat dissipation device is at least a heat sink made of aluminum alloy.