Heat disspation structure of electronic apparatus

Abstract

A heat dissipation structure of an electronic apparatus includes a bendable vapor chamber with a large area. A small section of the vapor chamber is arranged to contact with the heat source of the electronic apparatus and a large remaining section of the vapor chamber contacts with an internal wall of the chassis of the electronic apparatus through appropriate bending. The working fluid in the vapor chamber absorbs the heat generated by the heat source and vaporizes. The heat-carrying vapor spreads within the vapor chamber to condense on a large condensation zone. The released heat is then dissipated to the atmosphere via the large area of the chassis and the heat dissipating fin structure thereon. Therefore, the heat dissipation structure provides efficient passive heat dissipation.

1 . A heat dissipation structure of an electronic apparatus, wherein said electronic apparatus comprises at least a chassis and a circuit board disposed inside said chassis, wherein said circuit board contains at least a heat source; and said heat dissipation structure comprises:
 a bendable vapor chamber disposed inside said chassis and said vapor chamber is bent into multiple sections including at least a first flat section, a second flat section and a bent section between said first flat section and said second flat section, and the area of said second flat section is larger than that of said first flat section, wherein said first flat section contacts with said heat source on said circuit board, and said second flat section contacts with an internal wall of said chassis.   
     
     
         2 . The heat dissipation structure of the electronic apparatus according to  claim 1 , further comprising a heat dissipating fin structure disposed on an external wall of said chassis. 
     
     
         3 . The heat dissipation structure of the electronic apparatus according to  claim 1 , wherein the thickness of said vapor chamber is between 0.8 mm to 1.5 mm. 
     
     
         4 . The heat dissipation structure of the electronic apparatus according to  claim 1 , wherein said circuit board contains a plurality of heat sources disposed on the same face of said circuit board such that said first flat section of said vapor chamber contacts with said plurality of heat sources at the same time. 
     
     
         5 . The heat dissipation structure of the electronic apparatus according to  claim 1 , further comprising a plurality of first fastening elements for fastening said first flat section onto said circuit board so that said first flat section contacts with said heat source. 
     
     
         6 . The heat dissipation structure of the electronic apparatus according to  claim 1 , further comprising a plurality of second fastening elements for fastening said second flat section onto said internal wall of the chassis. 
     
     
         7 . The heat dissipation structure of the electronic apparatus according to  claim 1 , further comprising an interface material arranged between said heat source and said first flat section, and/or between said internal wall and said second flat section. 
     
     
         8 . The heat dissipation structure of the electronic apparatus according to  claim 7 , wherein said interface material is selected from the group consisting of thermal pad, thermal grease, thermal paste, and thermal tape. 
     
     
         9 . The heat dissipation structure of the electronic apparatus according to  claim 1 , wherein the surface of at least an external wall of said chassis is treated to increase the radiative emissivity thereof. 
     
     
         10 . The heat dissipation structure of the electronic apparatus according to  claim 2 , wherein the external surface of said heat dissipating fin structure is treated to increase the radiative emissivity thereof. 
     
     
         11 . The heat dissipation structure of the electronic apparatus according to  claim 1 , further comprising a heat sink disposed on a side wall of said second flat section of said vapor chamber, the side wall opposite to the side wall of said second flat section which contacts with said internal wall. 
     
     
         12 . The heat dissipation structure of the electronic apparatus according to  claim 11 , further comprising a fan collocating with said heat sink. 
     
     
         13 . A heat dissipation structure of an electronic apparatus, wherein said electronic apparatus comprises at least a chassis including a first internal wall and a second internal wall facing against each other, and a circuit board inside said chassis, wherein said circuit board contains at least a first heat source and at least a second heat source disposed on the opposite faces of said circuit board; and said heat dissipation structure comprises:
 a first bendable vapor chamber and a second bendable vapor chamber disposed inside said chassis, and at least one of said first vapor chamber and said second vapor chamber is bent into multiple sections including at least a first flat section, a second flat section and a bent section between said first flat section and said second flat section, and the area of said second flat section is larger than that of said first flat section, wherein said first flat section of said first vapor chamber contacts with said first heat source, and said second flat section contacts with said first internal wall; said first flat section of said second vapor chamber contacts with said second heat source and said second flat section contacts with said second internal wall.   
     
     
         14 . The heat dissipation structure of the electronic apparatus according to  claim 13 , further comprising at least a heat dissipating fin structure disposed on at least one of the two opposite external walls of said chassis. 
     
     
         15 . The heat dissipation structure of the electronic apparatus according to  claim 13 , wherein said chassis is an upright chassis, and said circuit board is vertically disposed inside said chassis. 
     
     
         16 . The heat dissipation structure of the electronic apparatus according to  claim 15 , wherein said first heat source and said second heat source are respectively located on the lower portion of the opposite two faces of said circuit board. 
     
     
         17 . The heat dissipation structure of the electronic apparatus according to  claim 13 , wherein the thicknesses of said first vapor chamber and said second vapor chamber are between 0.8 mm to 1.5 mm. 
     
     
         18 . The heat dissipation structure of the electronic apparatus according to  claim 13 , further comprising a plurality of first fastening elements for fastening said first flat section of said first vapor chamber and said second vapor chamber onto said circuit board so that said first flat section of said first vapor chamber and said second vapor chamber contact respectively with said first heat source and said second heat source. 
     
     
         19 . The heat dissipation structure of the electronic apparatus according to  claim 13 , further comprising a plurality of second fastening elements for fastening said second flat section of said first vapor chamber and said second vapor chamber respectively onto said first internal wall and said second internal wall of said chassis. 
     
     
         20 . The heat dissipation structure of the electronic apparatus according to  claim 13 , further comprising an interface material arranged between said first heat source and said first flat section of said first vapor chamber, said second heat source and said first flat section of said second vapor chamber, said first internal wall and said second flat section of said first vapor chamber, and/or said second internal wall and said second flat section of said second vapor chamber. 
     
     
         21 . The heat dissipation structure of the electronic apparatus according to  claim 20 , wherein said interface material is selected from the group consisting of thermal pad, thermal grease, thermal paste, and thermal tape. 
     
     
         22 . The heat dissipation structure of the electronic apparatus according to  claim 13 , wherein at least an external surface of said chassis is treated to increase the radiative emissivity thereof. 
     
     
         23 . The heat dissipation structure of the electronic apparatus according to  claim 14 , wherein the external surface of said heat dissipating fin structure is treated to increase the radiative emissivity thereof. 
     
     
         24 . The heat dissipation structure of the electronic apparatus according to  claim 13 , further comprising a heat sink disposed on a side wall of said second flat section, the side wall opposite to the side wall of said second flat section which contacts with said first internal wall or said second internal wall. 
     
     
         25 . The heat dissipation structure of the electronic apparatus according to  claim 24 , further comprising a fan collocating with said heat sink.