System and Method for Providing Even Heat Distribution and Cooling Return Pads

Abstract

A return pad for use with an electrosurgical system is disclosed. The return pad includes a conductive layer, a contact layer configured to engage a patient's skin and an intermediate layer disposed between the conductive layer and the contact layer. The intermediate layer is adapted to distribute energy.

1 . A return pad for use with an electrosurgical system, comprising:
 a conductive layer;   a contact layer in contact with the conductive layer, disposed directly on the conductive layer and configured to engage and adhesively attach to patient skin; and   a cooling section in contact with the conductive layer, disposed directly on the conductive layer and configured to reduce the temperature of at least one of the contact layer and the conductive layer;   wherein the conductive layer separates the cooling layer from the contact layer thereby preventing direct contact therebetween.   
     
     
         2 . The return pad according to  claim 1 , wherein the cooling section is configured to absorb thermal energy generated in the return pad. 
     
     
         3 . The return pad according to  claim 1 , wherein the cooling section is configured to absorb thermal energy from the conductive layer and the contact layer. 
     
     
         4 . The return pad according to  claim 1 , wherein the cooling section includes a passive cooling device. 
     
     
         5 . The return pad according to  claim 1 , wherein the cooling section includes a Peltier cooling device. 
     
     
         6 . The return pad according to  claim 1 , wherein the cooling section includes a chemical layer. 
     
     
         7 . The return pad according to  claim 1 , further including a backing layer disposed on the cooling section and adapted to allow heat to dissipate therethrough. 
     
     
         8 . The return pad according to  claim 1 , wherein the cooling section further includes:
 an intermediate layer in contact with the conductive layer, disposed directly on the conductive layer and constructed from a material that distributes energy; and   a cooling device in contact with the intermediate layer, disposed directly on the intermediate layer.   
     
     
         9 . The return pad according to  claim 8 , wherein the cooling device is selected from a group consisting of an active cooling device and a passive cooling device. 
     
     
         10 . The return pad according to  claim 8 , wherein the intermediate layer is selected from a group consisting of a dielectric layer and a carbon layer. 
     
     
         11 . The return pad according to  claim 1 , wherein at least a portion of the cooling section includes at least one cooling chamber configured to allow fluid to flow therethrough. 
     
     
         12 . A return pad cooling system for electrosurgical surgery comprising:
 a return pad including:
 a conductive layer; 
 a contact layer in contact with the conductive layer, disposed directly on the conductive layer and configured to engage and adhesively attach to patient skin; 
 a cooling section in contact with the conductive layer, disposed directly on the conductive layer and configured to reduce the temperature of at least one of the contact layer and the conductive layer, the cooling section including one or more cooling chambers configured to allow fluid to flow therethrough; 
 wherein the conductive layer separates the cooling layer from the contact layer thereby preventing direct contact therebetween, and 
   a cooling system that supplies cooling fluid to the cooling chamber.   
     
     
         13 . The cooling system according to  claim 12 , wherein the cooling system includes a pump that circulates cooling fluid through the cooling chamber. 
     
     
         14 . The cooling system according to  claim 12 , where the cooling section further includes an intermediate layer disposed on the conductive layer and configured to distribute energy.